[6-[2-[4-[2-[4-[2-[3-[2-[4-[[4-(3,5-Dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoyl]amino]phenoxy]acetyl]phenyl]-2-oxoethoxy]phenoxy]acetyl]phenoxy]acetyl]naphthalen-2-yl] 4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoate

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: [6-[2-[4-[2-[4-[2-[3-[2-[4-[[4-(3,5-Dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoyl]amino]phenoxy]acetyl]phenyl]-2-oxoethoxy]phenoxy]acetyl]phenoxy]acetyl]naphthalen-2-yl] 4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoate
• 英文别名: [6-[2-[4-[2-[4-[2-[3-[2-[4-[[4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoyl]amino]phenoxy]acetyl]phenyl]-2-oxoethoxy]phenoxy]acetyl]phenoxy]acetyl]naphthalen-2-yl] 4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoate
• 化学式: C₇₄H₅₉N₃O₁₅
• 分子量: 1230.3
• InChiKey: QQJKDQAHQQVVFK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  12
• 重原子数：
  92
• 可旋转键数：
  23
• 环数：
  14.0
• sp3杂化的碳原子比例：
  0.24
• 拓扑面积：
  235
• 氢给体数：
  1
• 氢受体数：
  15

文献信息

• RESIN COMPOSITION WITH ENHANCED HEAT-RELEASING PROPERTIES, HEAT-RELEASING FILM, INSULATING FILM, AND PREPREG
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140187674A1

  公开（公告）日：2014-07-03

  This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.