1-[(2,3,6-Trimethylcyclohexyl)methyl]pyrrole-2,5-dione

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 英文名称: 1-[(2,3,6-Trimethylcyclohexyl)methyl]pyrrole-2,5-dione
• 英文别名: 1-[(2,3,6-trimethylcyclohexyl)methyl]pyrrole-2,5-dione
• 化学式: C₁₄H₂₁NO₂
• 分子量: 235.32
• InChiKey: ONNNVDUJBRCYCX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.71
• 拓扑面积：
  37.4
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• SEALANT COMPOSITION FOR ELECTRONIC DEVICE
  申请人：HENKEL AG & CO. KGAA

  公开号：US20140187714A1

  公开（公告）日：2014-07-03

  The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.