4-[3-(4-Cyanophenyl)-2,4-di(propan-2-yl)phenyl]benzonitrile

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-[3-(4-Cyanophenyl)-2,4-di(propan-2-yl)phenyl]benzonitrile
• 英文别名: 4-[3-(4-cyanophenyl)-2,4-di(propan-2-yl)phenyl]benzonitrile
• 化学式: C₂₆H₂₄N₂
• 分子量: 364.5
• InChiKey: CMFCQKXTXWEZCF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.9
• 重原子数：
  28
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  47.6
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME
  申请人：Guangdong Shengyi Sci. Tech Co., Ltd

  公开号：EP2770005A1

  公开（公告）日：2014-08-27

  Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its pre-polymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its pre-polymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its pre-polymer to the component (B) an active ester is 0.2-5 to 1. The high frequency circuit board manufactured by using the epoxy resin composition comprises multiple layers of laminated semi-cured sheets and copper foils press-bonded on both sides of them, and each of the multiple layers of laminated semi-cured sheets comprises a substrate and the epoxy resin composition attached on it by impregnating and drying.

  本发明公开了一种环氧树脂组合物和使用该组合物制造的高频电路板，环氧树脂组合物由以下固体成分组成：(A) 具有至少两个氰氧基的氰酸酯化合物或其预聚物，(B) 活性酯，以及 (C) 含有萘酚结构的环氧树脂。以这些固体组分的重量份数为基准，组分（A）具有至少两个氰氧基的氰酸酯化合物或其预聚物和组分（B）活性酯的总量为 10-70 重量份数，组分（C）含有萘酚结构的环氧树脂的量为 30-90 重量份数，其中组分（A）具有至少两个氰氧基的氰酸酯化合物或其预聚物与组分（B）活性酯的重量比为 0.使用环氧树脂组合物制造的高频电路板包括多层层压半固化片和压接在其两侧的铜箔，每层多层层压半固化片包括基板和通过浸渍和干燥附着在其上的环氧树脂组合物。