1-[8-[3,4-Diheptyl-6-[8-(2-methylidene-5-oxopyrrol-1-yl)octyl]cyclohex-3-en-1-yl]octyl]pyrrole-2,5-dione

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 英文名称: 1-[8-[3,4-Diheptyl-6-[8-(2-methylidene-5-oxopyrrol-1-yl)octyl]cyclohex-3-en-1-yl]octyl]pyrrole-2,5-dione
• 英文别名: 1-[8-[3,4-diheptyl-6-[8-(2-methylidene-5-oxopyrrol-1-yl)octyl]cyclohex-3-en-1-yl]octyl]pyrrole-2,5-dione
• 化学式: C₄₅H₇₄N₂O₃
• 分子量: 691.1
• InChiKey: UNHYWHFCXVREPG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  14.3
• 重原子数：
  50
• 可旋转键数：
  30
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.76
• 拓扑面积：
  57.7
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• SEALANT COMPOSITION
  申请人：HENKEL AG & CO. KGAA

  公开号：US20140242301A1

  公开（公告）日：2014-08-28

  A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.