4-[4-Carboxy-3-(2-chloro-2-oxoethyl)phenoxy]-2-(2-chloro-2-oxoethyl)benzoic acid

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-[4-Carboxy-3-(2-chloro-2-oxoethyl)phenoxy]-2-(2-chloro-2-oxoethyl)benzoic acid
• 英文别名: 4-[4-carboxy-3-(2-chloro-2-oxoethyl)phenoxy]-2-(2-chloro-2-oxoethyl)benzoic acid
• 化学式: C₁₈H₁₂Cl₂O₇
• 分子量: 411.2
• InChiKey: XQZKWMRXGJYHPL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  27
• 可旋转键数：
  8
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.11
• 拓扑面积：
  118
• 氢给体数：
  2
• 氢受体数：
  7

文献信息

• INSULATION MATERIAL FOR ELECTRONIC DEVICE
  申请人：LG Chem, Ltd.

  公开号：EP2804185A2

  公开（公告）日：2014-11-19

  The present invention relates to insulating material for an electronic device that may inhibit damage to an electronic device due to a high temperature curing process, and simultaneously exhibit excellent properties and reliability. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, exhibits imidization degree of 70% or more after curing at a temperature of 250°C, and comprises a low boiling point solvent having boiling point of 130 to 180°C as a residual solvent.

  本发明涉及一种用于电子设备的绝缘材料，该材料可抑制高温固化过程对电子设备造成的损坏，同时表现出优异的性能和可靠性。该电子设备绝缘材料由包含特定重复单元的可溶性聚酰亚胺树脂组成，在 250°C 的温度下固化后，亚胺化程度达到或超过 70%，并包含沸点为 130 至 180°C 的低沸点溶剂作为残留溶剂。
• US20140256876A1
  申请人：——

  公开号：US20140256876A1

  公开（公告）日：2014-09-11
• Insulation Material for Electronic Device
  申请人：LG Chem, Ltd.

  公开号：US20140296408A1

  公开（公告）日：2014-10-02

  The present invention relates to insulating material for an electronic device that may inhibit damage to an electronic device due to a high temperature curing process, and simultaneously exhibit excellent properties and reliability. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, exhibits imidization degree of 70% or more after curing at a temperature of 250° C., and comprises a low boiling point solvent having boiling point of 130 to 180° C. as a residual solvent.