2-[[1,1,1,3,3,3-Hexafluoro-2-[3-[1,1,1,3,3,3-hexafluoro-2-(oxiran-2-ylmethoxy)propan-2-yl]phenyl]propan-2-yl]oxymethyl]oxirane | 26146-93-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-[[1,1,1,3,3,3-Hexafluoro-2-[3-[1,1,1,3,3,3-hexafluoro-2-(oxiran-2-ylmethoxy)propan-2-yl]phenyl]propan-2-yl]oxymethyl]oxirane
• CAS: 26146-93-0
• 化学式: C₁₈H₁₄F₁₂O₄
• 分子量: 522.3
• InChiKey: OGKXDOHOOONBIR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.8
• 重原子数：
  34
• 可旋转键数：
  8
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  16

反应信息

• 作为反应物：
  描述：

  2-[[1,1,1,3,3,3-Hexafluoro-2-[3-[1,1,1,3,3,3-hexafluoro-2-(oxiran-2-ylmethoxy)propan-2-yl]phenyl]propan-2-yl]oxymethyl]oxirane 生成 [3-[1,1,1,3,3,3-Hexafluoro-2-[3-[1,1,1,3,3,3-hexafluoro-2-[2-hydroxy-3-(2-methylprop-2-enoyloxy)propoxy]propan-2-yl]phenyl]propan-2-yl]oxy-2-hydroxypropyl] 2-methylprop-2-enoate
  参考文献：
  名称：

  VASIMI, AKIRA;JOSIDA, MASAO;KIMURA, KAORU

  摘要：

  DOI：

文献信息

• CLATHRATE COMPOUND, CURING CATALYST, COMPOSITION FOR FORMING CURED RESIN, AND CURED RESIN
  申请人：KANEKO Masami

  公开号：US20120088920A1

  公开（公告）日：2012-04-12

  A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where R 1 represents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where R 2 represents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and R 3 to R 5 each independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent.

  一种治疗催化剂（包合物），其在低温下抑制固化反应，从而提高一锅稳定性，但可以在热处理时有效固化树脂。包合物至少包含一个由式（I）表示的异苯二甲酸化合物，其中R1代表C1至C6烷基，C1至C6烷氧基，硝基或羟基，以及由式（II）表示的咪唑化合物，其中R2代表氢原子，C1至C10烷基，苯基，苄基或氰乙基，R3至R5各自独立地代表氢原子，硝基或卤素原子，或C1至C20烷基，苯基，苄基或可能具有取代基的C1至C20酰基。
• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。
• Epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus
  申请人：CANON KABUSHIKI KAISHA

  公开号：EP1329472A1

  公开（公告）日：2003-07-23

  An embodiment of the invention relates to a novel epoxy resin composition. The epoxy resin composition comprises (i) a first epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, and having a number average molecular weight ranging from 8,000 to 22,000 and a polydispersity ranging from 3.5 to 5.0, (ii) a second epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, having a number average molecular weight ranging from 2,500 to 8,000 and a polydispersity ranging from 1.5 to 3.0, and (iii) a cationic polymerization catalyst.

  本发明的一个实施方案涉及一种新型环氧树脂组合物。该环氧树脂组合物包括：(i) 第一环氧树脂，其分子中至少有一个憎水引发基和两个或两个以上的环状脂肪族环氧基，其平均分子量为 8,000 至 22,000 之间，多分散度为 3.5 至 5.0 之间；(ii) 第二环氧树脂，其分子中至少有一个憎水引发基和两个或两个以上的环状脂肪族环氧基，其平均分子量为 8,000 至 22,000 之间，多分散度为 3.5 至 5.0 之间。0，(ii)第二种环氧树脂，其分子中至少有一个憎水促进基团和两个或两个以上的环状脂肪族环氧基团，其平均分子量为 2,500 至 8,000 之间，多分散度为 1.5 至 3.0 之间，以及(iii)阳离子聚合催化剂。
• Epoxy resin composition, surface treatment method, liquid-jet recording head and liquid-jet recording apparatus
  申请人：CANON KABUSHIKI KAISHA

  公开号：EP1329473A1

  公开（公告）日：2003-07-23

  The present invention relates to an epoxy resin composition. The epoxy resin composition contains an epoxy resin and a cationic polymerization catalyst. The epoxy resin has at least two alicyclic epoxy groups, at least one perfluoroalkyl group having 6 to 12 carbon atoms, at least one alkylsiloxane group, and at least one cyclic group.

  本发明涉及一种环氧树脂组合物。环氧树脂组合物含有环氧树脂和阳离子聚合催化剂。环氧树脂具有至少两个脂环族环氧基团、至少一个具有 6 至 12 个碳原子的全氟烷基、至少一个烷基硅氧烷基团和至少一个环状基团。
• PHOTOSENSITIVE COMPOSITION, DISPLAY MEMBER, AND PROCESS FOR PRODUCING THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1980910A1

  公开（公告）日：2008-10-15

  Disclosed is a photosensitive composition comprising 50 to 5% by weight of a photosensitive organic component and 50 to 95% by weight of a glass powder, wherein the glass powder contains 70 to 85% by weight of Bi2O3, 3 to 15% by weight of SiO2, 5 to 20% by weight of B2O3, 0 to 3% by weight of ZrO2 and 1 to 10% by weight of ZnO, expressed in terms of oxide. The present invention provides a photosensitive composition which enables fine pattern work by photolithography to be used in various members of a flat panel display and a fluorescence emission tube.

  本发明公开了一种光敏组合物，该组合物包括50-5%（重量）的光敏有机组分和50-95%（重量）的玻璃粉，其中玻璃粉含有70-85%（重量）的Bi2O3、3-15%（重量）的SiO2、5-20%（重量）的B2O3、0-3%（重量）的ZrO2和1-10%（重量）的ZnO，以氧化物表示。 本发明提供了一种光敏组合物，它可以在平板显示器和荧光发射管的各种部件中使用光刻技术进行精细图案加工。