申请人:JSR CORPORATION
公开号:US20200117087A1
公开(公告)日:2020-04-16
A radiation-sensitive resin composition contains: a first polymer including a first structural unit that includes a phenolic hydroxy group, and a second structural unit that includes an acid-labile group; a second polymer including a fluorine atom, a silicon atom, or both, and including a third structural unit that includes an alkali-labile group; a first compound that generates upon an irradiation with a radioactive ray an acid capable of dissociating the acid-labile group within 1 minute under a temperature T
X
° C. of no less than 80° C. and no greater than 130° C.; and a second compound that generates upon an irradiation with a radioactive ray a carboxylic acid, a sulfonic acid, or both, the carboxylic acid and the sulfonic acid each being not capable of substantially dissociating the acid-labile group within 1 minute under the temperature T
X
° C.