N-Cyclohexyl-phthalamide | 105802-63-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N-Cyclohexyl-phthalamide
• 英文别名: 1,2-Benzenedicarboxamide, N-cyclohexyl-；2-N-cyclohexylbenzene-1,2-dicarboxamide
• CAS: 105802-63-9
• 化学式: C₁₄H₁₈N₂O₂
• 分子量: 246.309
• InChiKey: JUTPABDZLMJBGJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.9
• 重原子数：
  18
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.43
• 拓扑面积：
  72.2
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  邻苯二甲酸亚胺 、 环己胺 以 氯仿 为溶剂， 反应 4.0h， 以88%的产率得到N-Cyclohexyl-phthalamide
  参考文献：
  名称：

  Search for radioprotectors in the series of glutamic acid derivatives

  摘要：

  DOI：

  10.1007/bf01148642

文献信息

• CURED PRODUCT
  申请人：LG Chem, Ltd.

  公开号：EP3067382A1

  公开（公告）日：2016-09-14

  The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

  本申请涉及一种固化产品及其用途。例如，将该固化物应用于 LED 等半导体器件时，即使长期使用该器件，也可最大限度地降低亮度，而且由于该固化物具有优异的抗裂性，因此可提供具有高长期可靠性的器件。固化物具有优异的加工性、可加工性和粘合性等，并且不会产生发白和表面粘连等现象。此外，固化物还具有优异的高温耐热性、气体阻隔性等。例如，固化产品可用作半导体设备的封装材料或粘合材料。
• Cured product
  申请人：LG CHEM, LTD.

  公开号：US10090219B2

  公开（公告）日：2018-10-02

  The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

  本申请涉及一种固化产品及其用途。例如，将该固化物应用于 LED 等半导体器件时，即使长期使用该器件，也可最大限度地降低亮度，而且由于该固化物具有优异的抗裂性，因此可提供具有高长期可靠性的器件。固化物具有优异的加工性、可加工性和粘合性等，并且不会产生发白和表面粘连等现象。此外，固化物还具有优异的高温耐热性、气体阻隔性等。例如，固化产品可用作半导体设备的封装材料或粘合材料。
• EP3067382B1
  申请人：——

  公开号：EP3067382B1

  公开（公告）日：2020-12-23
• US9805999B2
  申请人：——

  公开号：US9805999B2

  公开（公告）日：2017-10-31
• US9837329B2
  申请人：——

  公开号：US9837329B2

  公开（公告）日：2017-12-05