申请人:MICROCOSM TECHNOLOGY CO., LTD.
公开号:US20220204698A1
公开(公告)日:2022-06-30
The present invention provides a polyimide comprising a structural unit, which comprises a first structural unit represented by formula (1) and a second structural unit represented by formula (2), wherein A, D and E are defined herein. A polyimide film formed by the polyimide has a low linear thermal expansion coefficient.