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(2,6-dinitrophenyl)methyl N-phenylcarbamate

中文名称
——
中文别名
——
英文名称
(2,6-dinitrophenyl)methyl N-phenylcarbamate
英文别名
——
(2,6-dinitrophenyl)methyl N-phenylcarbamate化学式
CAS
——
化学式
C14H11N3O6
mdl
——
分子量
317.25
InChiKey
SDSYKTIIBSOEMS-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2.7
  • 重原子数:
    23
  • 可旋转键数:
    4
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.07
  • 拓扑面积:
    130
  • 氢给体数:
    1
  • 氢受体数:
    6

文献信息

  • PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    申请人:Toray Industries, Inc.
    公开号:EP3203320A1
    公开(公告)日:2017-08-09
    To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6). 7.5≤X≤75 2.5≤Y≤40 1.5×Y≤X≤3×Y
    提供一种光敏树脂组合物,该组合物能够形成具有高分辨率的图案并获得具有优异的耐热性和抗裂性的固化膜,而且还可进行碱显影;提供一种方法,该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤;以及提供一种使用该组合物制造半导体器件的方法。公开了一种包括聚硅氧烷(A)的光敏树脂组合物,其中聚硅氧烷(A)是由通式(1)表示的聚硅氧烷,且(X)和(Y)由通式(4)至(6)表示。7.5≤x≤75 2.5≤y≤40 1.5×y≤x≤3×y
  • Photosensitive resin composition, protective film, and liquid crystal display element
    申请人:Chi Mei Corporation
    公开号:US10162260B2
    公开(公告)日:2018-12-25
    The invention shows a photosensitive resin composition which can be used in protective film and liquid crystal display element and provides good transparency and high chemical resistance. The composition includes a complex resin (A), an o-naphthoquinone diazide sulfonate (B), and a solvent (C). The complex resin (A) includes a main chain and a side chain. The main chain includes a repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The side chain includes a repeating unit derived from siloxane based monomer (a2), and is bonded to the repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The complex resin (A) satisfies at least one of the following conditions (I) and (II): Condition (I): the main chain further includes a repeating unit derived from unsaturated monomer (a1-1) including a carboxylic acid or a carboxylic anhydride. Condition (II): the siloxane based monomer (a2) includes a monomer (a2-1) represented by formula (A-4).
    本发明展示了一种光敏树脂组合物,可用于保护膜和液晶显示元件,具有良好的透明性和高耐化学腐蚀性。该组合物包括复合树脂(A)、邻萘醌重氮磺酸盐(B)和溶剂(C)。复合树脂(A)包括一条主链和一条侧链。主链包括由硅氧烷(甲基)丙烯酸酯单体(a1-2)衍生的重复单元。侧链包括硅氧烷基单体(a2)衍生的重复单元,并与硅氧烷(甲基)丙烯酸酯基单体(a1-2)衍生的重复单元键合。复合树脂(A)至少满足以下条件(I)和(II)之一: 条件 (I):主链还包括一个由不饱和单体(a1-1)衍生的重复单元,不饱和单体(a1-1)包括羧酸或羧酸酐。 条件(II):硅氧烷基单体(a2)包括由式(A-4)表示的单体(a2-1)。
  • Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device
    申请人:TORAY INDUSTRIES, INC.
    公开号:US10409163B2
    公开(公告)日:2019-09-10
    To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).
    提供一种光敏树脂组合物,该组合物能够形成高分辨率的图案并获得具有优异耐热性和抗裂性的固化膜,而且还可进行碱显影;提供一种方法,该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤;以及提供一种使用该组合物制造半导体器件的方法。本发明公开了一种包括聚硅氧烷(A)的光敏树脂组合物。
  • Positive type photo-sensitive siloxane composition, curing film formed by the composition and device with the curing film
    申请人:TORAY INDUSTRIES, INC.
    公开号:EP1662322B1
    公开(公告)日:2017-01-11
  • POSITIVE-TYPE RADIATION-SENSITIVE COMPOSITION, CURED FILM, INTERLAYER INSULATING FILM, METHOD OF FORMING INTERLAYER INSULATING FILM, DISPLAY DEVICE, AND SILOXANE POLYMER FOR FORMING INTERLAYER INSULATING FILM
    申请人:HANAMURA Masaaki
    公开号:US20110008730A1
    公开(公告)日:2011-01-13
    The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.
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