Methyltriphenylphosphonium dimethyl phosphate | 20445-91-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Methyltriphenylphosphonium dimethyl phosphate
• 英文别名: dimethyl phosphate;methyl(triphenyl)phosphanium
• CAS: 20445-91-4
• 化学式: C21H24O4P2
• 分子量: 402.4
• InChiKey: AVRUQJIZSCIKJJ-UHFFFAOYSA-M

计算性质

• 辛醇/水分配系数(LogP)：
  3.36
• 重原子数：
  27
• 可旋转键数：
  5
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.14
• 拓扑面积：
  58.6
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• Heat activatable adhesives for wire scribed circuit boards
  申请人：Advanced Interconnection Technology, Inc.

  公开号：EP0227002A1

  公开（公告）日：1987-07-01

  A non-tacky, solid, adhesive composition which can be activated without C-staging the polymeric resin, upon application of sufficient heat or ultrasonic energy for a time period less than one second, comprising a) at least one film forming polymeric resin of number average molecular weight (Mn) of at least about 10 000 and having a hydroxyl, epoxide or unsaturated function­ality greater than about 7, the polymeric resin being selected from the group of polyols consisting of poly­esters, polyurethanes, phenoxies, epoxies and mixtures thereof; b) a plasticizer present in an amount which permits the activation without C-staging of the polymeric resin; c) a curing agent which is capable of cross­linking and curing the polymeric resin to a C-stage, the curing agent being present in an amount sufficient to C-stage the polymeric resin.

  一种不粘手的固体粘合剂组合物，当施加足够的热量或超声波能量，时间不超过 1 秒钟时，可在不对聚合树脂进行 C 阶段活化，该组合物包括 a) 至少一种成膜聚合树脂，其平均分子量（Mn）至少约为 10 000，羟基、环氧或不饱和官能度大于约 7，该聚合树脂选自由聚酯、聚氨酯、苯氧基、环氧及其混合物组成的多元醇组；b) 增塑剂，其用量应能使聚合树脂活化而无需 C 级； c) 能使聚合树脂交联和固化至 C 级的固化剂，其用量应足以使聚合树脂 C 级。
• Heat activatable adhesive for wire scribed circuits
  申请人：Advanced Interconnection Technology, Inc.

  公开号：EP0212238B1

  公开（公告）日：1991-07-10
• Resin composition for thermosetting coating
  申请人：MITSUI CHEMICALS, INC.

  公开号：EP0522456B1

  公开（公告）日：1998-10-07
• DIELECTRIC COMPOSITE MATERIAL FOR FINGERPRINT SENSOR INDUCTION LAYER AND PREPARATION METHOD THEREOF
  申请人：TECORE SYNCHEM INC.

  公开号：US20170121520A1

  公开（公告）日：2017-05-04

  Provided is a dielectric composite material for a fingerprint sensor induction layer and a preparation method therefor, wherein the dielectric composite material is made from the following components: an epoxy resin, a phenolic resin, a first type of dielectric inorganic filler, a second type of dielectric inorganic filler, a curing agent, an adhesion promoter, a mould releasing agent and a flame retardant. The dielectric composite material has a high dielectric constant, a small dielectric loss, very stable dielectric properties which change very little with the test frequency, non-transparency and high hardness, such that the fingerprint sensor induction layer prepared therefrom satisfies the requirements of reliability and stability while reaching the thickness requirement, and can be used in various portable electronic products. The dielectric composite material for the fingerprint sensor induction layer is free of heavy metal lead, and is green and environmentally friendly. The dielectric composite material has convenience and high safety, and therefore the terminal application thereof can not only replace the existing digital-input password identification system, but can also be used on any electronic component in need of security.
• US3948855A
  申请人：——

  公开号：US3948855A

  公开（公告）日：1976-04-06