1,1'-[Propane-2,2-diylbis(benzene-4,1-diyloxybenzene-4,1-diyl)]dipyrrolidine-2,5-dione

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,1'-[Propane-2,2-diylbis(benzene-4,1-diyloxybenzene-4,1-diyl)]dipyrrolidine-2,5-dione
• 英文别名: 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrolidin-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrolidine-2,5-dione
• 化学式: C₃₅H₃₀N₂O₆
• 分子量: 574.6
• InChiKey: TZGBNKNMHSQGQT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.3
• 重原子数：
  43
• 可旋转键数：
  8
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  93.2
• 氢给体数：
  0
• 氢受体数：
  6

文献信息

• THERMOSETTING RESIN COMPOSITION FOR LDS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
  申请人：Sumitomo Bakelite Co.Ltd.

  公开号：EP3901214A1

  公开（公告）日：2021-10-27

  A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS includes the following components: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and (D) a coupling agent, in which the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and at least one of the following conditions is satisfied. Condition 1: a ratio of particles having a particle size equal to or more than 1 µm and equal to or less than 20 µm in the component (B) is equal to or more than 40% by volume and equal to or less than 95% by volume with respect to a total volume of the component (B), and Condition 2: an angle of fall of the thermosetting resin composition for LDS is equal to or less than 35°.

  一种用于激光直接成型（LDS）的热固性树脂组合物包括以下成分：(A)一种热固性树脂；(B)一种无机填料；(C)一种非导电金属化合物，在用活性能量射线照射时形成金属核；以及(D)一种偶联剂，其中组分(A)包含一种或多种选自环氧树脂和双马来酰亚胺树脂组成的组，并且至少满足下列条件之一。 条件 1：相对于组分（B）的总体积，组分（B）中粒径等于或大于 1 微米且等于或小于 20 微米的颗粒的体积比等于或大于 40%，且等于或小于 95%，且 条件 2：LDS 热固性树脂组合物的下降角等于或小于 35°。
• CURABLE COMPOSITION FOR MAKING CURED LAYER WITH HIGH THERMAL STABILITY
  申请人：CANON KABUSHIKI KAISHA

  公开号：US20220185915A1

  公开（公告）日：2022-06-16

  A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa·s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.