申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20210200083A1
公开(公告)日:2021-07-01
A resist composition containing: (A) a resin containing a repeating unit having an acid-labile group; (B) a photo-acid generator shown by a general formula (B-1); and (C) a solvent, where W
1
represents a cyclic divalent hydrocarbon group having 4 to 12 carbon atoms and containing a heteroatom; W
2
represents a cyclic monovalent hydrocarbon group having 4 to 14 carbon atoms and not containing a heteroatom; Rf represents a divalent organic group shown by the following general formula; and M
+
represents an onium cation. This provides a resist composition and a patterning process that uses the resist composition that show a particularly favorable mask dimension dependency (mask error factor: MEF), LWR, and critical dimension uniformity (CDU) particularly in photolithography where a high-energy beam such as an ArF excimer laser beam is used as a light source.