2-Amino-5-[4-(4-amino-3-hydroxyphenyl)phenyl]phenol

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-Amino-5-[4-(4-amino-3-hydroxyphenyl)phenyl]phenol
• 英文别名: 2-amino-5-[4-(4-amino-3-hydroxyphenyl)phenyl]phenol
• 化学式: C₁₈H₁₆N₂O₂
• 分子量: 292.3
• InChiKey: GJFBHKRHXZMOSN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.1
• 重原子数：
  22
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  92.5
• 氢给体数：
  4
• 氢受体数：
  4

文献信息

• Organosilicon-modified polyimide resin composition and use thereof
  申请人：JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD

  公开号：US10982048B2

  公开（公告）日：2021-04-20

  The present disclosure discloses an organosilicon-modified polyimide resin composition, comprising an organosilicon-modified polyimide and a thermal curing agent, wherein the organosilicon-modified polyimide comprises a repeating unit represented by the following general formula (I): wherein Ar1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar2 is a di-valent organic group, R is each independently methyl or phenyl, and the thermal curing agent is selected from the group consisting of epoxy resin, isocyanate and bisoxazoline compounds. The resultant organosilicon-modified polyimide resin composition of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.

  本发明公开了一种有机硅改性聚酰亚胺树脂组合物，包括有机硅改性聚酰亚胺和热固化剂，其中有机硅改性聚酰亚胺包括由以下通式（I）表示的重复单元： 其中 Ar1 是具有苯环或脂环烃结构的四价有机基团，Ar2 是二价有机基团，R 独立地分别是甲基或苯基，热固化剂选自环氧树脂、异氰酸酯和双噁唑啉化合物组成的组。本公开的有机硅改性聚酰亚胺树脂组合物具有优异的透光性、耐热性和机械强度，适用于生产柔性 LED 灯丝。
• ORGANOSILICON-MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF
  申请人：JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO.,LTD

  公开号：US20190315921A1

  公开（公告）日：2019-10-17

  The present disclosure discloses an organosilicon-modified polyimide resin composition, comprising an organosilicon-modified polyimide and a thermal curing agent, wherein the organosilicon-modified polyimide comprises a repeating unit represented by the following general formula (I): wherein Ar 1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar 2 is a di-valent organic group, R is each independently methyl or phenyl, and the thermal curing agent is selected from the group consisting of epoxy resin, isocyanate and bisoxazoline compounds. The resultant organosilicon-modified polyimide resin composition of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.
• LED FILAMENT AND LED LIGHT BULB
  申请人：JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO.,LTD

  公开号：US20210221952A1

  公开（公告）日：2021-07-22

  The present disclosure discloses an LED filament, comprising a plurality of LED chips; at least two electrodes, each of the at least two electrodes is connected to at least one of the plurality of LED chips; and a light conversion layer comprising a top layer and a base layer, coated on at least two sides of the at least two electrodes, and a portion of the at least two electrodes is exposed by the light conversion layer, where the top layer and the base layer are located at two sides of the plurality of LED chips, respectively, wherein the base layer comprising an organosilicon-modified polyimide, a thermal curing agent and fluorescent powders. The present disclosure further discloses an LED light bulb. The base layer of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.