SOLUBLE IMIDE SKELETON RESIN, SOLUBLE IMIDE SKELETON RESIN SOLUTION COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
申请人:Hirai Takayoshi
公开号:US20120043508A1
公开(公告)日:2012-02-23
An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.