Liquid crystal compound and method of manufacturing the same, liquid crystal composition containing the same and liquid crystal display device
申请人:KABUSHIKI KAISHA TOSHIBA
公开号:EP0325035A2
公开(公告)日:1989-07-26
A compound represented by formula
In the formula, Ar represents
or
and each of Ra and Rb independently represents an optically non-active alkyl group or an optically active group having an asymmetric carbon atom. Either Ra or Rb is the optically active group. X represents
. Each of t and m represents 0 or 1.
由式表示的化合物
式中,Ar 代表
或
而 Ra 和 Rb 各自独立地代表一个光学非活性烷基或一个具有不对称碳原子的光学活性基团。Ra 或 Rb 均为光学活性基团。X 代表
.t 和 m 各自代表 0 或 1。
COMPOSITION AND METHOD FOR TEMPORARILY FIXING SOLID
申请人:JSR Corporation
公开号:EP1522567A1
公开(公告)日:2005-04-13
The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.
Composition and method for temporarily fixing solid
申请人:——
公开号:US20040185187A1
公开(公告)日:2004-09-23
The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.