2-Methoxycarbonyl-3-sulfanylbenzoic acid

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-Methoxycarbonyl-3-sulfanylbenzoic acid
• 英文别名: 2-methoxycarbonyl-3-sulfanylbenzoic acid
• 化学式: C₉H₈O₄S
• 分子量: 212.22
• InChiKey: WLKATFGXCNDSPB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  14
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.11
• 拓扑面积：
  64.6
• 氢给体数：
  2
• 氢受体数：
  5

文献信息

• CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND MERCAPTO COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20190121233A1

  公开（公告）日：2019-04-25

  A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of “footing” in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) in the nonresist portion; and the generation of development residue when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the photosensitive resin composition. A mercapto compound having a specific structure is included in the photosensitive resin composition, and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation, and a resin whose solubility in alkali increases under the action of acid.

  一种化学增感型正型光敏树脂组合物，能够抑制“足部”现象的发生，即底部（靠近支撑表面的一侧）的宽度变窄，小于顶部（靠近抗蚀层表面的一侧）的宽度，同时在使用该光敏树脂组合物在基板的金属表面上形成用作电镀物品模板的抗蚀图案时，能够减少残留物的产生。该光敏树脂组合物中包含一种具有特定结构的巯基化合物，其中包括一个酸发生剂，该酸发生剂在暴露于辐射活性光线或辐射时产生酸，以及一种树脂，在酸的作用下其在碱性溶液中的溶解度增加。
• Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US11022880B2

  公开（公告）日：2021-06-01

  A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of “footing” in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) in the nonresist portion; and the generation of development residue when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the photosensitive resin composition. A mercapto compound having a specific structure is included in the photosensitive resin composition, and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation, and a resin whose solubility in alkali increases under the action of acid.

  一种化学放大正型感光树脂组合物，能够抑制非抗蚀部分出现底部（靠近支撑物表面的一面）宽度比顶部（靠近抗蚀层表面的一面）宽度窄的 "起脚 "现象；以及当使用该感光树脂组合物在基底的金属表面上形成作为电镀物品模板的抗蚀图案时产生显影残留物。感光树脂组合物中含有一种具有特定结构的巯基化合物，它包括一种在受到照射的活性射线或辐射时产生酸的酸发生器，以及一种在酸的作用下其碱溶解度增加的树脂。