1,1'-(3,6,9,12-Tetraoxatetradecane-1,14-diyl)bis(1H-pyrrole-2,5-dione)

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 英文名称: 1,1'-(3,6,9,12-Tetraoxatetradecane-1,14-diyl)bis(1H-pyrrole-2,5-dione)
• 英文别名: 1-[2-[2-[2-[2-[2-(2,5-dioxopyrrol-1-yl)ethoxy]ethoxy]ethoxy]ethoxy]ethyl]pyrrole-2,5-dione
• 化学式: C₁₈H₂₄N₂O₈
• 分子量: 396.4
• InChiKey: PFLADQMTADPVBA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -1.9
• 重原子数：
  28
• 可旋转键数：
  15
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.56
• 拓扑面积：
  112
• 氢给体数：
  0
• 氢受体数：
  8

文献信息

• Process for cosmetic treatment of keratin materials
  申请人：L'OREAL

  公开号：US10646428B2

  公开（公告）日：2020-05-12

  The invention relates to a cosmetic treatment process, in particular for caring for or making up keratin materials, comprising the following steps: a) a step of applying, to the keratin materials, a cosmetic composition comprising a compound comprising at least 2 maleimide groups; b) a step of applying a cosmetic composition comprising a compound comprising at least 2 furfuryl groups. The invention also relates to a kit comprising the two compositions, enabling said process to be carried out. The invention also relates to copolymers furfuryl (meth)acrylate, specifically (meth)acrylamide, and addition monomer chosen from polyethylene glycol (meth)acrylates and polydimethylsiloxanes with mono(meth)acryloyloxy end group.

  本发明涉及一种化妆品处理工艺，特别是用于护理或妆点角蛋白材料，包括以下步骤：a) 向角蛋白材料涂抹一种化妆品组合物，该组合物包含至少 2 个马来酰亚胺基团的化合物；b) 涂抹一种化妆品组合物，该组合物包含至少 2 个糠基团的化合物。本发明还涉及一种包含上述两种组合物的试剂盒，使上述工艺得以实施。本发明还涉及(甲基)丙烯酸糠酯共聚物，特别是(甲基)丙烯酰胺，以及从聚乙二醇(甲基)丙烯酸酯和具有单(甲基)丙烯酰氧基末端基团的聚二甲基硅氧烷中选择的添加单体。
• PROCESS FOR COSMETIC TREATMENT OF KERATIN MATERIALS
  申请人：L'Oréal

  公开号：EP3383360A1

  公开（公告）日：2018-10-10
• CURABLE COMPOSITION FOR IMPRINTS, PATTERN-FORMING METHOD AND PATTERN
  申请人：FUJIFILM Corporation

  公开号：US20140050900A1

  公开（公告）日：2014-02-20

  Provide is a curable composition for imprints capable of keeping a good pattern and heat resistance. A curable composition for imprints comprising a polymerizable compound (Ax-1) having maleimide structure(s), or a compound (Ax-2) having a partial structure represented by formula (I) below. Formula (I)
• Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device
  申请人：Nippon Kayaku Kabushiki Kaisha

  公开号：US20190203048A1

  公开（公告）日：2019-07-04

  To provide a maleimide resin composition which is curable by a curing process equivalent to that of an epoxy resin and can achieve moldability (curability) at 200° C. or less, heat resistance of 250° C. or more, retention of high thermal stability and high elastic modulus at 250° C., and low dielectric constant/low dielectric loss tangent. A maleimide resin composition including a maleimide compound (A) and a sulfonyl compound (B) containing, in the molecule, a structure represented by the following formula (1): (wherein each of the plurality of R's independently represents an alkenyl group, an alkenyl ether group, a hydrogen tom, a halogen atom, an alkyl group having a carbon number of 1 to 10, a fluoroalkyl group having a carbon number of 1 to 4, a hydroxyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxyl group, a tertiary carbon structure-containing group, a cyclic alkyl group, or a glycidyl group; at least one R is an alkenyl group or an alkenyl ether group; and a represents an integer of 1 to 4).
• US9482950B2
  申请人：——

  公开号：US9482950B2

  公开（公告）日：2016-11-01