2-(triphenyl-λ5-phosphanyl)benzene-1,4-diol

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-(triphenyl-λ5-phosphanyl)benzene-1,4-diol
• 化学式: C₂₄H₂₁O₂P
• 分子量: 372.4
• InChiKey: BTOGVZJZBWYKJA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.5
• 重原子数：
  27
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• RESIN COMPOSITION FOR FIXING, ROTOR, AUTOMOBILE, AND METHOD FOR MANUFACTURING ROTOR
  申请人：Sumitomo Bakelite Company Limited

  公开号：EP2787606A1

  公开（公告）日：2014-10-08

  A solid fixing resin composition, which has excellent filling properties, and a rotor using the same are provided. The fixing resin composition is used to form a fixing member constituting a rotor which includes a rotor core (110) which has a laminate formed by lamination of a plurality of plate members, is fixed and installed on a rotating shaft, and has a plurality of hole portions (150) arranged along the peripheral portion of the rotating shaft, provided in the laminate; a magnet (120) inserted in the hole portion (150); and a fixing member (130) formed by curing a fixing resin composition, filled in the separation portion between the hole portion (150) and the magnet (120), the resin composition including a thermosetting resin (A) containing an epoxy resin; a curing agent (B); and an inorganic filler (C), in which the ICI viscosity at 150°C of the epoxy resin is equal to or less than 3 poises.

  本发明提供了一种填充性能优异的固体固定树脂组合物和一种使用该组合物的转子。该固定树脂组合物用于形成构成转子的固定部件，该转子包括转子铁芯 (110)，该转子铁芯具有由多个板状部件层压形成的层压板，固定安装在旋转轴上，并具有沿旋转轴外围布置的多个孔部 (150)，孔部 (150) 设置在层压板上；磁铁 (120) 插入孔部 (150) 中；通过固化固定树脂组合物形成的固定部件（130），填充在孔部分（150）和磁铁（120）之间的分离部分中，树脂组合物包括含有环氧树脂的热固性树脂（A）、固化剂（B）和无机填料（C），其中环氧树脂在 150°C 时的 ICI 粘度等于或小于 3ppises。
• EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED EPOXY RESIN OBJECT, AND COMPOSITE MATERIAL
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3686231A1

  公开（公告）日：2020-07-29

  An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of η'2/η'1 equal to 3 or less, wherein η'1 is an initial dynamic shear viscosity (Pa·s) and η'2 is a maximum value of dynamic shear viscosity (Pa s), in a measurement of dynamic shear viscosity.

  一种环氧树脂，由具有中生结构的环氧化合物组成，η'2/η'1 的值等于或小于 3，其中η'1 是动态剪切粘度测量中的初始动态剪切粘度（Pa-s），η'2 是动态剪切粘度的最大值（Pa s）。
• Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
  申请人：Showa Denko Materials Co., Ltd.

  公开号：US11352562B2

  公开（公告）日：2022-06-07

  An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of η′2/η′1 equal to 3 or less, wherein η′1 is an initial dynamic shear viscosity (Pa·s) and η′2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.

  一种环氧树脂，由具有中生结构的环氧化合物组成，η′2/η′1 的值等于或小于 3，其中η′1 是动态剪切粘度测量中的初始动态剪切粘度（Pa-s），η′2 是动态剪切粘度的最大值（Pa-s）。
• Resin composition for semiconductor encapsulation and semiconductor device
  申请人：Endo Masashi

  公开号：US20070232728A1

  公开（公告）日：2007-10-04

  An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which exhibit high flame resistance, and high soldering resistance after humidified, and has an advantage of low material and production costs. A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1), and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H. for 168 hours:
• EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND THIN SEMICONDUCTOR DEVICE
  申请人：OSADA Shoichi

  公开号：US20080083995A1

  公开（公告）日：2008-04-10

  An epoxy resin composition for encapsulating a semiconductor device is provided. This composition contains the following components (A), (C), (D), (E), (F) and (G) as critical components: (A) an epoxy resin; (C) an inorganic filler; (D) a curing accelerator of the general formula (1): (E) a radical initiator; (F) a compound having at least two maleimide group per molecule; and (G) a phenol compound having at least one alkenyl group per molecule.