The invention relates to an activating composition for the electroless plating of non-conductive surfaces, in particular electronic printed circuit boards.
The composition contains a metal complex in which the ligand consists of a quaternary nitrogen compound, especially a compound in which nitrogen forms part of a heterocyclic system and is quaternarized with a radical comprising an acid residue carrying a negative charge, for example a sulphonated group.
The invention also concerns a method for the electroless plating involving the use of such composition, preceded by a preliminary treatment of the substrate and followed by the reduction of activating metal.
The activating composition according to the invention allows to fix firmly the activator metal to the substrate.  
                            本发明涉及一种用于非导电表面(尤其是电子印刷电路板)无电解电镀的活化组合物。
该组合物含有一种
金属络合物,其中的配位体由季氮化合物组成,特别是氮构成杂环系统的一部分,并与含有带负电荷的酸残基(例如磺化基)的基团季化的化合物。
本发明还涉及一种无电解电镀方法,其中包括使用这种组合物,先对基体进行初步处理,然后还原活化
金属。
根据本发明的活化组合物可以将活化剂
金属牢固地固定在基底上。