2-(triphenyl-λ5-phosphanyl)phenol

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-(triphenyl-λ5-phosphanyl)phenol
• 化学式: C₂₄H₂₁OP
• 分子量: 356.4
• InChiKey: GLWYMGRSVQAWPH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.8
• 重原子数：
  26
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• Curing accelerator, epoxy resin composition, and semiconductor device
  申请人：SUMITOMO BAKELITE CO., LTD.

  公开号：EP1369445A1

  公开（公告）日：2003-12-10

  A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

  提供了一种适用于各种可固化树脂组合物的固化促进剂，具有优异固化性、贮存稳定性和流动性的环氧树脂组合物，以及具有优异防止锡膏开裂和抗潮湿可靠性的半导体器件。该环氧树脂组合物包括具有一个分子中两个或更多环氧基团的化合物（A），具有一个分子中两个或更多酚羟基团的化合物（B），三取代磷酰苯酚酯或其盐作为固化促进剂（C），以及无机填料（D）。
• POLARIZED FILM, OPTICAL FILM, AND IMAGE DISPLAY DEVICE
  申请人：NITTO DENKO CORPORATION

  公开号：US20150049380A1

  公开（公告）日：2015-02-19

  A polarizing film, comprising a polarizer; transparent protective films with a water-vapor permeability of 150 g/m2/24 hours or less provided on both sides of the polarizer; and adhesive layers each interposed between the polarizer and one of the transparent protective films, wherein the adhesive layers are formed by applying an active energy ray to an active energy ray-curable adhesive composition containing a radically polymerizable compound, and the transparent protective films are bonded to the polarizer with the adhesive layers.

  一种偏光膜，包括偏光器；透明保护膜，在偏光器的两侧提供，其水汽渗透率为每平方米每24小时150克或以下；以及粘合层，每个粘合层夹在偏光器和一个透明保护膜之间，其中粘合层是通过将活性能量射线应用于含有自由基聚合化合物的活性能量射线可固化粘合剂组成的，透明保护膜与偏光器通过粘合层粘合在一起。
• Resin Composition For Semiconductor Encapsulation And Semiconductor Device
  申请人：Kuroda Hirofumi

  公开号：US20080097010A1

  公开（公告）日：2008-04-24

  The object of the invention is to provide a resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation comprising (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).
• Curing Accelerator, Curable Resin Composition and Electronic Parts Device
  申请人：Nakamura Shinya

  公开号：US20090012232A1

  公开（公告）日：2009-01-08

  A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below. (wherein, R 1 is selected from the group consisting of a hydrogen atom, and substituted or unsubstituted hydrocarbon groups of 1 to 18 carbon atoms, two or more R 1 groups may be bonded together to form a cyclic structure, R 2 and R 3 are selected from the group consisting of a hydrogen atom, a hydroxyl group, and substituted or unsubstituted organic groups of 1 to 18 carbon atoms, two or more R 2 or R 3 groups may be bonded together to form a cyclic structure, YH represents an organic group of 0 to 18 carbon atoms containing one or more releasable protons (H + ), and may be bonded to one or more R 2 groups to form a cyclic structure, m represents an integer from 1 to 4, and p represents a number of 0 or greater).
• RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
  申请人：Kuroda Hirofumi

  公开号：US20110021665A1

  公开（公告）日：2011-01-27

  A resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The resin composition for semiconductor encapsulation includes (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).