9,9-双(4-羟基-3-甲基苯基)芴二缩水甘油醚 | 114205-89-9

• 物质功能分类: 香精与香料 - 合成香料 - 酚类、醚类和环氧化物
• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 中文名称: 9,9-双(4-羟基-3-甲基苯基)芴二缩水甘油醚
• 英文名称: 9,9-bis[3-methyl-4-(2,3-epoxypropoxy)phenyl]fluorene
• 英文别名: 2,2'-((((9H-Fluorene-9,9-diyl)bis(2-methyl-4,1-phenylene))bis(oxy))bis(methylene))bis(oxirane)；2-[[2-methyl-4-[9-[3-methyl-4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane
• CAS: 114205-89-9
• 化学式: C₃₃H₃₀O₄
• 分子量: 490.599
• InChiKey: ABXGZTBEQZOCEE-UHFFFAOYSA-N

物化性质

• 熔点：
  85-95℃
• 沸点：
  611.3±55.0 °C(Predicted)
• 密度：
  1.237

计算性质

• 辛醇/水分配系数(LogP)：
  6.7
• 重原子数：
  37
• 可旋转键数：
  8
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.27
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

制备方法与用途

应用领域广泛，9,9-双(4-羟基-3-甲基苯基)芴二缩水甘油醚不仅用作有机合成中间体，还作为医药中间体。它主要应用于实验室研发和化工生产过程。

文献信息

• AROMATIC AMINE COMPOUND, CURING AGENT FOR EPOXY COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING AROMATIC AMINE COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20210130284A1

  公开（公告）日：2021-05-06

  An aromatic amine compound capable of satisfactorily forming a cured product having exceptional alkali resistance by reaction with an epoxy compound; a curing agent for an epoxy compound, the curing agent including the aromatic amine compound; a curable composition including the curing agent for an epoxy compound; a cured product of the curable composition; a method for producing the cured product; and a method for producing the abovementioned aromatic amine compound. The aromatic amine compound has a structure such that a specific position in a central skeleton comprising a fused ring such as a fluorene ring is substituted with a side-chain group including two aromatic groups linked by a flexible bond such as an amide bond, at least one amino group is bonded to the end of the side-chain group, and the structure has no hydroxyl groups.

  一种芳香胺化合物，通过与环氧化合物反应能够满意地形成具有异常碱性抗性的固化产品；一种环氧化合物的固化剂，该固化剂包括芳香胺化合物；一种包括环氧化合物的固化剂的可固化组合物；可固化组合物的固化产品；生产所述固化产品的方法；以及生产上述芳香胺化合物的方法。该芳香胺化合物具有这样的结构，即中心骨架中的特定位置包括类似于芴环的融合环，该位置被取代为包括通过柔性键（如酰胺键）连接的两个芳香基的侧链基团，至少一个氨基固定在侧链基团的末端，并且该结构不含羟基。
• Glycidylethers of fluorene-containing bisphenols
  申请人：MINNESOTA MINING AND MANUFACTURING COMPANY

  公开号：EP0274209A1

  公开（公告）日：1988-07-13

  Diglycidyl ethers of ortho-substituted­4-hydroxyphenylfluorenes, curable compositions comprising the diglycidyl ethers, and cured resins thereof have a high glass transition and an improved modulus of elasticity. The diglycidyl ethers of the invention for use in the curable composition of the invention can be mixtures obtained by the reaction of epihalohydrin with mixtures of fluorenebisphenols obtained by the reaction of one mole of one or more fluorenones with two or more moles or mixtures of two or more ortho-substituted phenols. The compositions are useful in molding and coating applications and in composite articles where the operating temperature of the article or material is elevated.

  原代-4-羟基苯基芴的二缩水甘油醚、包含该二缩水甘油醚的可固化组合物及其固化树脂具有较高的玻璃化转变和更好的弹性模量。 用于本发明可固化组合物的本发明二缩水甘油醚可以是由表卤代烃与由一摩尔的一种或多种芴酮与两种或多种原代苯酚或两种或多种原代苯酚的混合物反应得到的芴双酚的混合物。 该组合物适用于模塑和涂层应用，以及物品或材料工作温度较高的复合物品。
• INSULATING SHEET AND LAMINATED STRUCTURE
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2316897A1

  公开（公告）日：2011-05-04

  The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

  本发明提供了一种绝缘片材，它在未固化时具有极佳的可操作性，可防止在层压机中过度流动，并可提供具有极佳的介电击穿特性、导热性、耐热性和可加工性的固化产品。用于将导热系数为 10 W/m-K 或更高的热导体与导电层粘合的绝缘片材，包括(A) 具有 10,000 或以上重量平均分子量的聚合物；(B) 具有芳香族骨架且重量平均分子量为 600 或以下的环氧单体 (B1) 和具有芳香族骨架且重量平均分子量为 600 或以下的氧杂环丁烷单体 (B2) 中的至少一种；(C) 固化剂；(D) 20-60%（体积）的第一种无机填料；以及 (E) 1-40%（体积）的有机填料（E1）和第二种无机填料（E2）中的至少一种，第二种无机填料与第一种无机填料（D）不同，其新莫氏硬度为 3 或更低；当填料（E）包含有机填料（E1）时，有机填料（E1）的比例为 3-40%（体积）。
• CURABLE COMPOSITION
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：EP3002304A1

  公开（公告）日：2016-04-06

  To provide a curable composition which is curable at a low temperature within a short time regardless of the type of epoxy compound to be mixed, and also exhibits a long pot life; an adhesive comprising the curable composition; a method for producing a fiber-reinforced composite material using the curable composition; and a fiber-reinforced composite material comprising a matrix consisting of the curable composition. An (A) epoxy compound, (B) at least one crosslinking agent selected from the group consisting of a polyhydric amine compound and a polyhydric carboxylic anhydride, and a (C) compound which is an imidazolyl group-containing compound having a predetermined structure are mixed in a curable composition.

  本发明旨在提供一种可固化组合物，该组合物无论混合何种类型的环氧化合物，均可在短时间内低温固化，并且具有较长的固化寿命；一种包含该可固化组合物的粘合剂；一种使用该可固化组合物生产纤维增强复合材料的方法；以及一种包含由该可固化组合物构成的基体的纤维增强复合材料。将(A)环氧化合物、(B)至少一种从多氢胺化合物和多氢羧酸酐组成的组中选出的交联剂和(C)具有预定结构的含咪唑基团的化合物混合在可固化组合物中。
• FILM MATERIAL AND PATTERN FORMING PROCESS
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3309613A1

  公开（公告）日：2018-04-18

  A film material includes a support film having a transmittance of at least 60 % with respect to light of wavelength 300-450 nm, and a resin layer containing 0.001-10 wt% of a basic compound with a molecular weight of up to 10,000, and having a thickness of 1-100 µm. A pattern is formed by attaching the resin layer in the film material to a chemically amplified negative resist layer on a wafer, exposing, baking, and developing the resist layer. The profile of openings in the pattern is improved.

  一种薄膜材料包括一层支撑膜，该支撑膜对波长 300-450 纳米的光的透射率至少为 60%，以及一层树脂层，该树脂层含有 0.001-10 wt%的基本化合物，其分子量不超过 10,000，厚度为 1-100 µm。将薄膜材料中的树脂层附着在晶片上的化学放大负抗蚀层上，然后对抗蚀层进行曝光、烘烤和显影，即可形成图案。图案中的开口轮廓得到改善。