苯基膦酸钙 | 24391-19-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 苯基膦酸钙
• 中文别名: 甲基4-(1-甲基-1H-吡唑-5-基)苯酸酯
• 英文名称: calcium phenylphosphonate
• 英文别名: calcium;dioxido-oxo-phenyl-λ5-phosphane
• CAS: 24391-19-3
• 化学式: C₆H₅O₃P*Ca
• 分子量: 196.156
• InChiKey: SSTALXWJLKACQG-UHFFFAOYSA-L

计算性质

• 辛醇/水分配系数(LogP)：
  -1.16
• 重原子数：
  11
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  63.2
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  苯膦酸 在 calcium(II) chloride dihydrate 、 sodium hydroxide 作用下， 以 水 为溶剂， 生成 苯基膦酸钙
  参考文献：
  名称：

  METHOD FOR PRODUCING PHOSPHONIC ACID METAL SALT FINE PARTICLES

  摘要：

  公开号：

  EP2431374B1

文献信息

• PRODUCTION PROCESS OF PHOSPHONIC ACID METAL SALT AND THERMOPLASTIC RESIN COMPOSITION CONTAINING PHOSPHONIC ACID METAL SALT
  申请人：Suwa Takeshi

  公开号：US20110196077A1

  公开（公告）日：2011-08-11

  A method for producing a phenylphosphonic acid metal salt, including reacting a phenylphosphonic acid compound (a) with a metal salt, metal oxide or metal hydroxide (b) that is present in an amount beyond the equivalent; a phenylphosphonic acid metal salt composition comprising a phenylphosphonic acid metal salt and surplus metal salt, surplus metal oxide or surplus metal hydroxide produced by the method; and a thermoplastic resin composition comprising the phenylphosphonic acid metal salt composition.

  一种生产苯基膦酸金属盐的方法，包括将苯基膦酸化合物（a）与过量的金属盐、金属氧化物或金属氢氧化物（b）反应，所述金属盐、金属氧化物或金属氢氧化物的量超过当量；一种苯基膦酸金属盐组成物，包括苯基膦酸金属盐和剩余的金属盐、金属氧化物或金属氢氧化物，所述剩余物是由该方法产生的；以及一种热塑性树脂组成物，包括所述苯基膦酸金属盐组成物。
• METHOD FOR PRODUCING PHENYLPHOSPHONIC ACID METAL SALT COMPOSITION, AND CRYSTAL NUCLEATING AGENT THEREFROM
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20140330038A1

  公开（公告）日：2014-11-06

  A method for producing a phenylphosphonic acid metal salt composition, including reacting a phenylphosphonic acid compound (a) with a metal salt, metal oxide or metal hydroxide (b) that is present in an amount beyond the equivalent, the phenylphosphonic acid metal salt composition containing phenylphosphonic acid metal salt, and a surplus amount of the metal salt, the metal oxide or the surplus metal hydroxide (b). A crystal nucleating agent comprises the phenylphosphonic acid metal salt composition produced by the method.

  一种制备苯基膦酸金属盐组合物的方法，包括将苯基膦酸化合物（a）与金属盐、金属氧化物或金属氢氧化物（b）反应，其中金属盐、金属氧化物或金属氢氧化物（b）的量超过当量，所得到的苯基膦酸金属盐组合物包含苯基膦酸金属盐和过量的金属盐、金属氧化物或金属氢氧化物（b）。由该方法制备的苯基膦酸金属盐组合物是一种晶核剂。
• THERMOPLASTIC POLYMER COMPOSITION
  申请人：MILLIKEN & COMPANY

  公开号：US20150087759A1

  公开（公告）日：2015-03-26

  The invention provides a compound conforming to the structure of Formula (CXX) The invention also provides a thermoplastic polymer composition comprising a polyolefin polymer and a compound conforming to the structure of Formula (CXX) as a nucleating agent.

  本发明提供了符合CXX式结构的化合物。本发明还提供了一种热塑性聚合物组合物，包括聚烯烃聚合物和符合CXX式结构的化合物作为成核剂。
• Biaxially oriented polyester films
  申请人：TEIJIN LIMITED

  公开号：EP0066997A1

  公开（公告）日：1982-12-15

  A biaxially oriented polyester film composed of a polyester composition comprising (A) 100 parts by weight of a substantially linear polyalkylene terephthalate having ethylene terephthalate as a main structural component; (B) 0.01 to 5 parts by weight of an ester of an aliphatic polyol having at least 4 hydroxyl groups in the molecule with an aliphatic monocarboxylic acid having at least 8 carbon atoms; and (C) not more than 0.8 parts by weight of fine inorganic particles having an average particle diameter of not more than 1 micron and being substantially insoluble in the polyalkylene terephthalate is useful as a base of magnetic tapes.

  一种双向拉伸聚酯薄膜，由聚酯组合物组成，其中包括 (A) 100 份（重量）以对苯二甲酸乙二醇酯为主要结构成分的线性聚对苯二甲酸乙二醇酯； (B) 0.01 至 5 份（重量份數）分子中至少有 4 個羥基的脂肪族多元醇與 至少有 8 個碳原子的脂肪族一元羧酸的酯；及 (C) 不超过 0.8 重量份的无机微粒，其平均粒径不超过 1 微米，且基本不溶于聚 对苯二甲酸乙二醇酯，可用作磁带的基料。
• Resin encapsulation type semiconductor device
  申请人：KABUSHIKI KAISHA TOSHIBA

  公开号：EP0120981A1

  公开（公告）日：1984-10-10

  There is disclosed a highly reliable resin encapsulation type semiconductor device excellent humidity resistance as well as high temperature electric characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises a novolac type epoxy resin, a novolac type phenol resin, an organic phosphine compound and an organic phosphorus acid compound. The resin encapsulation type semiconductor device is markedly small in leak current under hot an humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.

  本发明公开了一种高度可靠的树脂封装型半导体器件，具有优异的耐湿性和高温电特性。其具体特点在于封装所使用的环氧树脂组合物。这种组合物由酚醛型环氧树脂、酚醛型苯酚树脂、有机膦化合物和有机磷酸化合物组成。 与现有技术相比，这种树脂封装型半导体器件在湿热条件下的泄漏电流明显较小，并且由于电极和铝线不易腐蚀而延长了使用寿命。