3,3'-Bis-(trifluormethyl)-4,4'-diisocyanato-biphenyl | 30437-39-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3'-Bis-(trifluormethyl)-4,4'-diisocyanato-biphenyl
• 英文别名: 1-Isocyanato-4-[4-isocyanato-3-(trifluoromethyl)phenyl]-2-(trifluoromethyl)benzene；1-isocyanato-4-[4-isocyanato-3-(trifluoromethyl)phenyl]-2-(trifluoromethyl)benzene
• CAS: 30437-39-9
• 化学式: C₁₆H₆F₆N₂O₂
• 分子量: 372.226
• InChiKey: XFOUHUDDOSBKBP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.9
• 重原子数：
  26
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.12
• 拓扑面积：
  58.9
• 氢给体数：
  0
• 氢受体数：
  10

反应信息

• 作为产物：
  描述：

  4-碘-1-硝基-2-(三氟甲基)苯 在 盐酸 、 铜 、 tin(ll) chloride 作用下， 以 1,4-二氧六环 为溶剂， 生成 3,3'-Bis-(trifluormethyl)-4,4'-diisocyanato-biphenyl
  参考文献：
  名称：

  Malichenko,B.F.; Tsypina,O.N., Journal of Organic Chemistry USSR (English Translation), 1970, vol. 6, p. 2302 - 2304

  摘要：

  DOI：

文献信息

• Thermosetting resin composition and cured product of the same
  申请人：DIC Corporation

  公开号：EP2540759A2

  公开（公告）日：2013-01-02

  A thermosetting resin composition comprising a polyimide resin (A) and a boron compound (B) represented by general formula (b3) below, wherein the polyimide resin (A) is a polyimide resin having a divalent structural unit represented by general formula (a1) below in the formula (b3), R3's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; and Z represents a nitrogen-containing heterocyclic compound.

  一种热固性树脂组合物，由聚酰亚胺树脂 (A) 和硼化合物 (B) 组成，如下文通式 (b3) 所示，其中聚酰亚胺树脂 (A) 是具有如下文通式 (a1) 所示二价结构单元的聚酰亚胺树脂 在式 (b3) 中，R3 各自独立地代表氢原子、具有 1 至 4 个碳原子的烷基或具有 1 至 4 个碳原子的烷氧基；以及 Z 代表含氮杂环化合物。
• THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND INTERLAYER ADHESIVE FILM FOR PRINTED WIRING BOARD
  申请人：DIC Corporation

  公开号：EP2671920A1

  公开（公告）日：2013-12-11

  There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability at low temperature in a semicured state (in the B-stage) and excellent flame resistance in a completely cured state; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (bl) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.

  本发明提供了一种热固性聚酰亚胺树脂组合物，该组合物能够生产出具有优异尺寸稳定性的固化产品，并且在半固化状态（B 阶段）下具有优异的低温熔融性，在完全固化状态下具有优异的阻燃性；本发明还提供了这种组合物的固化产品和用于印刷线路板的层间粘合膜，层间粘合膜由该组合物形成。特别是提供了一种热固性聚酰亚胺树脂组合物，该组合物含有热固性聚酰亚胺树脂（A）（其联苯骨架与五元环状亚胺骨架的氮原子直接相连，且重量平均分子量（Mw）在 3,000 至 150,000 之间）、磷化合物（B）（由具体式（bl）或（b2）表示）和环氧树脂（C）；这种组合物的固化产品；以及用于印刷线路板的层间粘合膜，层间粘合膜包括由该组合物形成的层，该层形成在载体薄膜上。
• THERMOSETTING RESIN COMPOSITE AND CURED PRODUCT THEREOF
  申请人：DIC Corporation

  公开号：EP2436734B1

  公开（公告）日：2014-07-23
• THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME
  申请人：Ichinose Eijyu

  公开号：US20120142829A1

  公开（公告）日：2012-06-07

  An object of the present invention is to provide a thermosetting resin composition having high heat resistance, high flame retardancy, good mechanical properties, and high dimensional stability. To achieve the object, there are provided a thermosetting resin composition containing a polyimide resin and a boron compound represented by general formula below and a cured product of the thermosetting resin composition. (R 1 's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. R 2 's each independently represent hydrogen, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Y represents a nitrogen-containing heterocyclic compound. R 3 's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Z represents a nitrogen-containing heterocyclic compound.)
• THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND INTERLAMINAR ADHESIVE FILM USED FOR PRINTED WIRING BOARD
  申请人：Murakami Kouichi

  公开号：US20130309489A1

  公开（公告）日：2013-11-21

  There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (b1) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.