2-[[2,3,5,6-Tetrafluoro-4-[2,3,5,6-tetrafluoro-4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane | 23779-39-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-[[2,3,5,6-Tetrafluoro-4-[2,3,5,6-tetrafluoro-4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane
• CAS: 23779-39-7
• 化学式: C₁₈H₁₀F₈O₄
• 分子量: 442.3
• InChiKey: DQAMAHVRCZKTIO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  30
• 可旋转键数：
  7
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  12

文献信息

• [EN] IMPROVEMENTS IN OR RELATING TO CURATIVES<br/>[FR] AMÉLIORATIONS APPORTÉES OU SE RAPPORTANT À DES AGENTS DE DURCISSEMENT
  申请人：HEXCEL COMPOSITES LTD

  公开号：WO2020216688A1

  公开（公告）日：2020-10-29

  The host compound in a clathrate is an amino or hydroxyl containing aromatic phosphorous compound, clathrates containing a resin curative and their use in curable resin compositions to produce moulded articles particularly fibre reinforced articles.

  在蛛网状化合物中的宿主化合物是一种含氨基或羟基的芳香磷化合物，这些蛛网状化合物含有树脂固化剂，可用于可固化树脂组合物中，以生产模塑制品，特别是纤维增强制品。
• CLATHRATE COMPOUND, CURING CATALYST, COMPOSITION FOR FORMING CURED RESIN, AND CURED RESIN
  申请人：KANEKO Masami

  公开号：US20120088920A1

  公开（公告）日：2012-04-12

  A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where R 1 represents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where R 2 represents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and R 3 to R 5 each independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent.

  一种治疗催化剂（包合物），其在低温下抑制固化反应，从而提高一锅稳定性，但可以在热处理时有效固化树脂。包合物至少包含一个由式（I）表示的异苯二甲酸化合物，其中R1代表C1至C6烷基，C1至C6烷氧基，硝基或羟基，以及由式（II）表示的咪唑化合物，其中R2代表氢原子，C1至C10烷基，苯基，苄基或氰乙基，R3至R5各自独立地代表氢原子，硝基或卤素原子，或C1至C20烷基，苯基，苄基或可能具有取代基的C1至C20酰基。
• [EN] UREA DERIVATIVES AND THEIR USE AS CURATIVES AND CURATIVE ACCELERATORS FOR RESIN SYSTEMS<br/>[FR] DÉRIVÉS D'URÉE ET LEUR UTILISATION EN TANT QU'AGENTS DE DURCISSEMENT ET ACCÉLÉRATEURS DE DURCISSEMENT POUR DES SYSTÈMES DE RÉSINE
  申请人：HEXCEL COMPOSITES LTD

  公开号：WO2022034201A1

  公开（公告）日：2022-02-17

  Bisorthohydroxy aromatic urones and their use as curatives and cure accelerators in resin systems particularly epoxy resin systems provide formulations with good outlife, low curing temperatures and desirable glass transition temperatures after curing, they are particularly useful in prepregs used in the production of components for the aerospace and wind turbine industries.

  Bisorthohydroxy芳香族尿酮及其在树脂体系中作为治疗剂和治疗加速剂的应用，特别是环氧树脂体系，提供具有良好使用寿命，低固化温度和固化后理想的玻璃转移温度的配方，它们在用于航空航天和风力涡轮机行业零部件生产的预浸料中特别有用。
• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。
• NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME
  申请人：Clariant International Ltd.

  公开号：EP1383006A1

  公开（公告）日：2004-01-21

  A negative working radiation sensitive resin composition comprising; an alkali-soluble novolak resin treated by fractionation and having 1,000 to 10,000 of weight average molecular weight as determined by polystyrene standard, where the portion with molecular weight of 500 or less is 5% or less in the total weight of the composition; a crosslinking agent; and a photo acid generator. This negative working radiation sensitive resin composition can be used preferably as etching resist, ion implantation resist, plating resist, LCD panel structural material such as spacer and electrode insulation material for an organic EL display because of having wide process margin, high heat resistance, high sensitivity, high resolution and good pattern shape.

  一种负工作辐射敏感树脂组合物，包括：经分馏处理的碱溶性酚醛树脂，按聚苯乙烯标准测定，其重量平均分子量为1,000至10,000，其中分子量为500或以下的部分占组合物总重量的5%或以下；交联剂；以及光酸发生器。这种负工作辐射敏感树脂组合物具有工艺余量大、耐热性高、灵敏度高、分辨率高和图案形状好等特点，可优先用作有机 EL 显示屏的蚀刻抗蚀剂、离子注入抗蚀剂、电镀抗蚀剂、液晶面板结构材料（如间隔物和电极绝缘材料）。