2-[4-(4-methylphenoxy)phenyl]-1H-isoindole-1,3(2H)-dione

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-[4-(4-methylphenoxy)phenyl]-1H-isoindole-1,3(2H)-dione
• 英文别名: 2-[4-(4-methylphenoxy)phenyl]isoindole-1,3-dione
• 化学式: C₂₁H₁₅NO₃
• 分子量: 329.3
• InChiKey: NGNPLODTCODMCP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.3
• 重原子数：
  25
• 可旋转键数：
  3
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  46.6
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Polyimide film for semiconductor package reflow process, and manufacturing method therefor
  申请人：IPI TECH INC.

  公开号：US11015089B2

  公开（公告）日：2021-05-25

  Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.

  本发明公开了一种用于半导体封装回流焊工艺的聚酰亚胺薄膜及其制造方法，该聚酰亚胺薄膜能够在回流焊工艺完成后，通过应用玻璃化转变温度小于或等于回流焊工艺温度的热塑性聚酰亚胺层，确保半导体芯片易于安装/拆卸。
• POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE REFLOW PROCESS, AND MANUFACTURING METHOD THEREFOR
  申请人：IPI TECH INC.

  公开号：US20190194496A1

  公开（公告）日：2019-06-27

  Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.