Thermosetting alkoxysilyl compound having two or more alkoxysilyl groups, composition and cured product comprising same, use thereof, and method for preparing alkoxysilyl compound
申请人:KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
公开号:US10428176B2
公开(公告)日:2019-10-01
The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”) having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.
本发明涉及:一种热固性烷氧基硅烷化合物(以下简称 "烷氧基硅烷化合物"),该化合物具有两个或两个以上的烷氧基硅烷基团,在复合材料中显示出优异的耐热特性;一种包含该化合物的组合物和固化产品;其用途;以及一种制备烷氧基硅烷化合物的方法。根据本发明,由新型烷氧基硅基化合物组成的烷氧基硅基化合物组合物在复合材料中显示出更好的耐热特性,即降低烷氧基硅基化合物组合物的 CTE,并且不显示玻璃化转变温度(以下称为 "无 Tg")。此外,根据本发明,由烷氧基硅烷化合物组成的固化产品因含有烷氧基硅烷基团而具有优异的阻燃性能。