申请人:Ciba Specialty Chemicals Corporation
公开号:US06261738B1
公开(公告)日:2001-07-17
Compounds of formula I, II and III, wherein
wherein R1 is for example hydrogen, C1-C12alkyl, C3-C30cycloalkyl, C2-C12alkenyl, C4-C8cycloalkenyl, phenyl, which is unsubstituted or substituted, naphthyl, anthracyl or phenanthryl, unsubstituted or substituted, heteroaryl radical which is unsubstituted or substituted; wherein all radicals R1 with the exception of hydrogen can additionally be substituted by a group having a —O—C-bond or a —O—Si-bond which cleaves upon the action of an acid; R′1 is for example phenylene, naphthylene, diphenylene or oxydiphenylene, wherein these radicals are unsubstituted or substituted; R2 is halogen or C1-C10haloalkyl; R3 is for example C1-C18alkylsulfonyl, phenylsulfonyl, naphthylsulfonyl, anthracylsulfonyl or phenanthrylsulfonyl, wherein the groups are unsubstituted or substituted, or R3 is e.g. C2-C6haloalkanoyl, or halobenzoyl, R′3 is for example phenylenedisulfonyl, naphthylenedisulfonyl, diphenylenedisulfonyl, or oxydiphenylenedisulfonyl, wherein these radicals are unsubstituted or substituted, X is halogen; are especially suitable as phototsensitive acid-donors in chemically amplified resist formulations.
式I、II和III的化合物,其中R1例如为氢、C1-C12烷基、C3-C30环烷基、C2-C12烯基、C4-C8环烯基、苯基,其未取代或取代,萘基、蒽基或菲基,其未取代或取代,杂环芳基基团,其未取代或取代;除氢外,所有R1基团均可进一步用具有—O—C键或—O—Si键的基团取代,该基团在酸作用下断裂;R′1例如为苯基、萘基、二苯基或氧二苯基,其中这些基团未取代或取代;R2为卤素或C1-C10卤代烷基;R3例如为C1-C18烷基磺酰基、苯基磺酰基、萘基磺酰基、蒽基磺酰基或菲基磺酰基,其中这些基团未取代或取代,或R3例如为C2-C6卤代酰基或卤代苯甲酰基,R′3例如为苯基二磺酰基、萘基二磺酰基、二苯基二磺酰基或氧二苯基二磺酰基,其中这些基团未取代或取代,X为卤素;特别适用于化学放大光刻胶配方中的光敏酸供体。