4-[4-(Propan-2-yl)benzyl]phenol | 6295-82-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-[4-(Propan-2-yl)benzyl]phenol
• 英文别名: 4-[(4-propan-2-ylphenyl)methyl]phenol
• CAS: 6295-82-5
• 化学式: C₁₆H₁₈O
• 分子量: 226.31
• InChiKey: OOCPZPVFLUTEBN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.8
• 重原子数：
  17
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• Heat curable resin composition, and circuit board with electronic component mounted thereon
  申请人：SAN-EI KAGAKU CO., LTD.

  公开号：US10870725B2

  公开（公告）日：2020-12-22

  A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

  本发明提供了一种可在回流焊接后通过加热和真空操作去除空隙的热固化树脂组合物，以及一种安装有电子元件的电路板。本实施例的热固化树脂组合物包括液态环氧树脂、由单羧酸和聚乙烯醚衍生的半缩醛酯、固化剂和填料。
• Toner for electrostatic image developement and image forming method and apparatus using the toner
  申请人：——

  公开号：US20020160290A1

  公开（公告）日：2002-10-31

  A toner for electrostatic image development in which the weight concentration of polar-solvent-soluble material is 1000 &mgr;g or less, based on the toner, and an image forming method comprising a step of forming a toner image by developing a latent electrostatic image by using the toner for electrostatic image development.

  一种用于静电图像显影的调色剂，其中极性溶剂可溶材料的重量浓度为 1000 &mgr;g 或以下（以调色剂为基准）；以及一种图像形成方法，包括通过使用该用于静电图像显影的调色剂显影潜伏静电图像来形成调色剂图像的步骤。
• POLYCARBONATE RESIN COMPOSITION
  申请人：KANEKA CORPORATION

  公开号：EP0861873B1

  公开（公告）日：2006-07-12
• METHOD FOR MANUFACTURING HOLE-FILLING PRINTED WIRING BOARD, CURABLE RESIN COMPOSITION AND HOLE-FILLING PRINTED WIRING BOARD
  申请人：SAN-EI KAGAKU CO., LTD.

  公开号：US20170066868A1

  公开（公告）日：2017-03-09

  A redundant part of a plated through hole that is formed in a printed wiring board is removed by a back drilling method; a penetration hole is filled entirely with a curable resin composition for hole filling; the curable resin composition is initially heated at a temperature less than 100° C. so that a curing rate of the curable resin composition may be 60% to 85%; and the curable resin composition is subsequently heated at a temperature 130° C. to 200° C. so that the curable resin composition may be cured completely, where the curable resin composition contains 1 part by mass to 200 parts by mass of a curing agent with respect to 100 parts by mass of liquid epoxy resin, and contains no solvent.
• HEAT CURABLE RESIN COMPOSITION, AND CIRCUIT BOARD WITH ELECTRONIC COMPONENT MOUNTED THEREON
  申请人：SAN-EI KAGAKU CO., LTD.

  公开号：US20170335049A1

  公开（公告）日：2017-11-23

  A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.