1-[6-(2,5-Dioxopyrrol-1-yl)-3,3,5-trimethylhexyl]pyrrole-2,5-dione

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 英文名称: 1-[6-(2,5-Dioxopyrrol-1-yl)-3,3,5-trimethylhexyl]pyrrole-2,5-dione
• 化学式: C₁₇H₂₂N₂O₄
• 分子量: 318.4
• InChiKey: MBRZODAIDIMWFX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.4
• 重原子数：
  23
• 可旋转键数：
  7
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.53
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• [(2-ETHOXY-5-TRANS-1-PROPEN-1-YL)-PHENOXYL]-TERMINATED COMPOUNDS
  申请人：Evonik Technochemie GmbH

  公开号：EP3144289A1

  公开（公告）日：2017-03-22

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as comonomers: wherein D is an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及符合式（I）的化合物和以聚马来酰亚胺树脂体系为基础、包含此类化合物作为共聚单体的热固化树脂组合物： 其中 D 是 x-官能团；以及 x 是一个≥ 2 的整数； 但 x-官能团 D 不是平均摩尔质量在 15000 g/mol 至 150000 g/mol 范围内的聚碳酸酯。 本发明还涉及可通过固化此类组合物获得的交联树脂。本发明的化合物可用于结构粘合剂、纤维预浸料基质树脂、模塑化合物以及结构和/或电气复合材料等领域。
• ALKENYLPHENOXY-SUBSTITUTED 1,1-DIPHENYLETHYLENES, PROCESSES FOR THEIR PREPARATION, AND THEIR USE
  申请人：Evonik Technochemie GmbH

  公开号：EP3144290A1

  公开（公告）日：2017-03-22

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as comonomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及符合式（I）的化合物和以聚马来酰亚胺树脂体系为基础、包含此类化合物作为共聚单体的热固化树脂组合物： 其中 R1 是氢或烯基苯氧基、 R2 是烯基苯氧基，以及 R3 是氢或含有 1 至 4 个碳原子的烷基。 本发明还涉及可通过固化此类组合物获得的交联树脂。本发明的化合物可用于结构粘合剂、纤维预浸料基质树脂、模塑化合物以及结构和/或电气复合材料等领域。
• Alkenylphenoxy-substituted 1,1-diphenylethylenes, processes for their preparation, and their use
  申请人：Evonik Technochemie GmbH

  公开号：US10233139B2

  公开（公告）日：2019-03-19

  The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites.

  本发明涉及根据式(I)的化合物和基于聚马来酰亚胺树脂体系的热固化组合物，该组合物包含此类化合物作为共聚单体：其中R1是氢或烯基苯氧基，R2是烯基苯氧基，R3是氢或具有1至4个碳原子的烷基。本发明还涉及可通过固化此类组合物获得的交联树脂。本发明的化合物可用于结构粘合剂、纤维预浸料基质树脂、模塑化合物以及结构和/或电气复合材料等领域。
• [(2-ethoxy-5-trans-1-propen-1-yl)-phenoxyl]-terminated compounds
  申请人：Evonik Technochemie GmbH

  公开号：US10308769B2

  公开（公告）日：2019-06-04

  A compound according to formula (I) can be part of a heat-curable resin composition based on polymaleimide resin systems comprising such compound as co-monomer: wherein D is an x-functional group; and x is an integer ≥2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. A crosslinked resin is obtainable by curing such composition. The compounds can be used in structural adhesives, matrix resins for fiber prepregs, moulding compounds, and structural and/or electrical composites.

  根据式（I）的化合物可以是以聚马来酰亚胺树脂体系为基础的热固化树脂组合物的一部分，该树脂体系包括作为共聚单体的此类化合物： 其中 D 为 x-官能团；x 为整数≥2；但 x-官能团 D 不是平均摩尔质量在 15000 g/mol 至 150000 g/mol 范围内的聚碳酸酯。通过固化这种组合物可以得到交联树脂。这种化合物可用于结构粘合剂、纤维预浸料的基质树脂、模塑化合物以及结构和/或电气复合材料。
• Resin composition, wiring layer laminate for semiconductor, and semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US10575402B2

  公开（公告）日：2020-02-25

  One aspect of the present invention relates to a resin composition comprising a curable resin and a curing agent, which is used for forming an inter-wiring layer insulating layer in contact with a copper wiring.

  本发明的一个方面涉及一种树脂组合物，该树脂组合物由可固化树脂和固化剂组成，用于形成与铜线接触的布线间绝缘层。