申请人:NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
公开号:US10077337B2
公开(公告)日:2018-09-18
A resin film, in which at least one of polyimide layers is a non-thermoplastic polyimide layer having a linear thermal expansion coefficient of 1×10−6 to 30×10−6 (1/K), is shown. The non-thermoplastic polyimide layer is composed of a polyimide which is produced by reacting an anhydride component containing an aromatic tetracarboxylic anhydride with a diamine component, wherein the diamine component contains both a dimer acid-type diamine produced by replacing each of two terminal carboxyl groups in a dimer acid with a primary aminomethyl or amino group and an aromatic diamine, and the dimer acid-type diamine is contained in an amount of 1 to 15 mol % relative to the whole diamine component.
图示为一种树脂薄膜,其中至少有一层聚酰亚胺层是线性热膨胀系数为 1×10-6 至 30×10-6 (1/K) 的非热塑性聚酰亚胺层。非热塑性聚酰亚胺层由聚酰亚胺组成,该聚酰亚胺是由含有芳香族四羧酸酐的酸酐组分与二胺组分反应生成的,其中二胺组分包含二聚酸中两个末端羧基分别被伯氨基甲基或氨基取代而生成的二聚酸型二胺和芳香族二胺,二聚酸型二胺的含量相对于整个二胺组分为 1 至 15 摩尔%。