1,1a(2)-[Methylenebis(2-methyl-4,1-phenylene)]bis[1H-pyrrole-2,5-dione] | 36394-79-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,1a(2)-[Methylenebis(2-methyl-4,1-phenylene)]bis[1H-pyrrole-2,5-dione]
• 英文别名: 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3-methylphenyl]methyl]-2-methylphenyl]pyrrole-2,5-dione
• CAS: 36394-79-3
• 化学式: C₂₃H₁₈N₂O₄
• 分子量: 386.4
• InChiKey: DRIJMZWXZMSZKJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  29
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.13
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  马来酸酐 、 3.3'-二甲基-4.4'二氨基二苯甲烷 生成 1,1a(2)-[Methylenebis(2-methyl-4,1-phenylene)]bis[1H-pyrrole-2,5-dione]
  参考文献：
  名称：

  KANAYAMA, KAORU;OKADZAKI, HOKO

  摘要：

  DOI：

文献信息

• METHOD OF PRODUCING POLYMER
  申请人：Japan as represented by President of Shizuoka University

  公开号：EP1598374A1

  公开（公告）日：2005-11-23

  A method of producing a polymer according to the present invention is characterized by comprising a step of photopolymerizing one or more photopolymerizable polymerization precursors by irradiation with an activation energy ray in a supercritical fluid or in a subcritical fluid.

  根据本发明生产聚合物的方法，其特征在于包括在超临界流体或亚临界流体中用活化能射线照射一种或多种可光聚合的聚合前体使其光聚合的步骤。
• POLYMER AND PROCESS FOR PRODUCING POLYMER
  申请人：KANSAI PAINT CO., LTD.

  公开号：EP1698647A1

  公开（公告）日：2006-09-06

  A process for producing a polymer, characterized in that a polymer having juts is produced by carrying out photopolymerization of at least one photopolymerizable polymerization precursor containing a photocurable compound having two or more unsaturated bonds by irradiation with active energy ray, optionally in the presence of at least one additive component for adding a polymer function, in a supercritical fluid or subcritical fluid; and a polymer having juts of 10 nm or more height, which height is 0.1-fold or more of the diameter of the juts, produced by the above process.

  一种生产聚合物的工艺，其特征在于：在超临界流体或亚临界流体中，通过活性能量射线照射至少一种含有具有两个或两个以上不饱和键的可光化化合物的可光化聚合前体，并可选择在至少一种用于增加聚合物功能的添加剂成分存在的情况下，对其进行光聚合反应，从而生产出具有突起的聚合物；以及通过上述工艺生产出具有 10 纳米或更高突起的聚合物，其突起高度为突起直径的 0.1 倍或更高。
• EPOXY RESIN, HARDENABLE RESIN COMPOSITION CONTAINING THE SAME AND USE THEREOF
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1852451A1

  公开（公告）日：2007-11-07

  It is an object of the present invention, with respect to a phenol aralkyl type epoxy resin, to suppress any crystal precipitation, improve the quality manageability and operation efficiency at composition production and enhance the properties, including heat resistance, thereof It is also intended to provide a resin composition that even when stored in the form of a varnish for a prolonged period of time, is resistant to crystal precipitation, excelling in storage stability and operation efficiency, and that gives a hardening product of low dielectric constant and low dielectric tangent excelling in heat resistance, water resistance and flame retardance. There is provided an epoxy resin characterized by comprising a phenol aralkyl type epoxy resin in which a content (an area % measured by gel permeation chromatography) of a bifunctional compound is 20% or less, and provided a resin composition obtained therefrom.

  本发明的目的是针对苯酚芳烷基型环氧树脂，抑制任何晶体析出，提高组合物生产的质量管理性和操作效率，并增强包括耐热性在内的各种性能、其目的还在于提供一种树脂组合物，该树脂组合物即使以清漆的形式长期储存，也能防止结晶析出，在储存稳定性和操作效率方面表现优异，并能提供低介电常数和低介电常数的硬化产品，在耐热性、耐水性和阻燃性方面表现优异。 本发明提供了一种环氧树脂，其特征在于该环氧树脂由酚芳基型环氧树脂组成，其中双官能团化合物的含量（用凝胶渗透色谱法测量的面积百分比）为 20% 或更少，并提供了由此获得的树脂组合物。
• THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2412743A1

  公开（公告）日：2012-02-01

  A thermosetting resin composition containing: (A) a resin composition having an unsaturated Maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

  一种热固性树脂组合物，含有(A) 一种具有不饱和马来酰亚胺基团的树脂组合物，该树脂组合物是由(a) 一种马来酰亚胺化合物和(b) 一种胺化合物在有机溶剂中反应生成的，前者每分子至少具有两个N-取代马来酰亚胺基团，后者每分子至少具有两个伯氨基；(B) 热固性树脂；以及 (C) 改性咪唑化合物，如异氰酸酯掩蔽咪唑和环氧树脂掩蔽咪唑，以及预浸料、带支架的绝缘膜、层压板和印刷线路板，每种材料都含有相同的成分。
• RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2666825A1

  公开（公告）日：2013-11-27

  Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.

  公开了一种树脂组合物，该树脂组合物含有(a)分子结构中至少有两个 N-取代马来酰亚胺基团的马来酰亚胺化合物和(b)分子结构中至少有一个活性有机基团的有机硅化合物；以及使用该树脂组合物的预浸料、层压板和印刷线路板。 可以提供一种具有优异耐热性和低热膨胀性的树脂组合物，以及使用该树脂组合物的预浸料、层压板和印刷线路板。