3,3'-Sulfonylbis(6-aminobenzoic acid) | 6338-59-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3'-Sulfonylbis(6-aminobenzoic acid)
• 英文别名: 2-amino-5-(4-amino-3-carboxyphenyl)sulfonylbenzoic acid
• CAS: 6338-59-6
• 化学式: C₁₄H₁₂N₂O₆S
• 分子量: 336.32
• InChiKey: GSBAMPHXDICKMU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  23
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  169
• 氢给体数：
  4
• 氢受体数：
  8

文献信息

• AROMATIC ETHER AND ALKYNYL CONTAINING PHTHALONITRILES
  申请人：Laskoski Matthew

  公开号：US20110288254A1

  公开（公告）日：2011-11-24

  Compounds having the formulas below. R is an aromatic-containing group. Each M is an alkali metal. Each m is a positive integer. The value of n is a positive integer. The value p is 0 or 1. If p is 0 then n is 1. A thermoset made by curing a composition containing the below phthalonitrile monomers. A method of reacting a diphenyl acetylene compound with an excess of an aromatic diol in the presence of an alkali metal carbonate to form the above oligomer. A method of reacting a phenoxyphthalonitrile with an acetylene compound to form the phthalonitrile monomer below.

  具有以下化学式的化合物。其中R是含芳香基团的基团。每个M是一种碱金属。每个m是正整数。n的值为正整数。p的值为0或1。如果p为0，则n为1。通过固化含有以下邻苯二腈单体的组合物制成的热固性材料。一种方法是在碱金属碳酸盐的存在下，将二苯乙炔化合物与过量的芳香二醇反应，形成上述寡聚物。一种方法是将苯氧基邻苯二腈与乙炔化合物反应，形成以下邻苯二腈单体。
• Photosensitive resin composition and photosensitive films and laminates made by using the same
  申请人：——

  公开号：US20040265731A1

  公开（公告）日：2004-12-30

  A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

  本发明的光敏树脂组合物包含(A)可溶性聚酰亚胺和(b)(甲基)丙烯酸化合物，其中(A)可溶性聚酰亚胺可在有机溶剂中溶解，并通过使用酸性二酐组分和至少一种含有硅氧烷结构或芳香环结构的二胺组分以及结构中具有羟基、羧基或羰基的二胺组分合成，(B)(甲基)丙烯酸化合物具有至少一个碳-碳双键，并且最好包含至少一个(C)光反应引发剂和(D)阻燃剂。通过这种安排，本发明的光敏树脂组合物具有优异的性能。特别是，本发明的光敏树脂组合物非常有用，可以用于电子零件等。
• Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
  申请人：Okada Koji

  公开号：US20060199920A1

  公开（公告）日：2006-09-07

  A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.

  本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种（甲基）丙烯酸化合物(B)，其中基础树脂组分(A)是以下任何一种：具有至少一个羟基或羧基的聚酰亚胺树脂(A-1)；具有至少一个羟基或羧基的聚酰胺树脂(A-2)；和光敏亚胺（甲基）丙烯酰基硅氧烷低聚物(A-3)。因此，可以实现特性，例如(1)实现和改善水系开发性能，(2)改善作为亚胺化膜的实用性，(3)改善后固化性能，以及(4)简化印刷线路基板的制造。因此，该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
• Oligomeric hydroxy arylether phthalonitiles and synthesis thereof
  申请人：——

  公开号：US20040181028A1

  公开（公告）日：2004-09-16

  An aromatic ether oligomer or polyaromatic ether comprising the formula: 1 wherein Ar is an independently selected divalent aromatic radical; formed by reacting a dihydroxyaromatic with a dihaloaromatic; and wherein the reaction is performed in the presence of a copper compound and cesium carbonate. The polyaromatic ether is formed when neither the dihydroxyaromatic nor the dihaloaromatic is present in an excess amount. The aromatic ether oligomer is formed by using an excess of either dihydroxyaromatic or dihaloaromatic. A phthalonitrile monomer comprising the formula: 2 formed by reacting a 3- or 4-nitrophthalonitrile with a hydroxy-terminated aromatic ether oligomer. A thermoset formed by curing the phthalonitrile monomer. Processes for forming all the above.

  一种芳香醚寡聚物或聚芳香醚，包括以下公式： 1 其中Ar是独立选择的二价芳香基团；通过将二羟基芳香与二卤代芳香反应形成；反应在铜化合物和碳酸铯的存在下进行。当二羟基芳香和二卤代芳香均不以过量存在时，形成聚芳香醚。当使用过量的二羟基芳香或二卤代芳香时，形成芳香醚寡聚物。一种酞菁单体，包括以下公式： 2 通过将3-或4-硝基酞菁与羟基终止的芳香醚寡聚物反应形成。通过固化酞菁单体形成热固性物。以上所有的形成过程。
• NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF
  申请人：Fujihara Kan

  公开号：US20100132989A1

  公开（公告）日：2010-06-03

  An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound.

  本发明的目的是提供一种聚酰亚胺前体组成物溶液，其(i)不使用硅氧烷二胺，(ii)可在低温（不超过250℃）下固化，且(iii)具有低粘度，无论其浓度如何，并提供一种光敏树脂组成物、光敏树脂膜、热固性树脂组成物、聚酰亚胺绝缘膜以及带有绝缘膜的印制电路板，每种产品都具有良好的物理性能，并通过使用聚酰亚胺前体组成物溶液获得。通过使用聚酰亚胺前体组成物溶液，该溶液至少包括(A)具有端羧基的聚氨酯酰亚胺寡聚体和(B)二胺化合物和/或异氰酸酯化合物，从而实现了上述目的。