1,4-Di-(p-carboxyphenylsulfonyl)-benzol | 55709-46-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,4-Di-(p-carboxyphenylsulfonyl)-benzol
• 英文别名: 4,4'-(1,4-Phenylenedisulfonyl)dibenzoic acid；4-[4-(4-carboxyphenyl)sulfonylphenyl]sulfonylbenzoic acid
• CAS: 55709-46-1
• 化学式: C₂₀H₁₄O₈S₂
• 分子量: 446.458
• InChiKey: YHPUOYIGPPMSRM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  30
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  160
• 氢给体数：
  2
• 氢受体数：
  8

文献信息

• ADHESIVE SHEET AND LAYERED PRODUCT
  申请人：TEIJIN LIMITED

  公开号：EP1589086A1

  公开（公告）日：2005-10-26

  There are provided an adhesive sheet, exhibiting a specific peel strength and shear peel strength and being composed of a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200°C or above and a thermal adhesive layer (C) comprising a fully aromatic polyamide having a glass transition temperature of 200-500°C, as well as a laminate composed of the sheet and a process for its production. Also provided is a method of release after treatment of the laminate composed of the adhesive sheet, to obtain a laminate having the target to-be-treated layer.

  本发明提供了一种具有特定剥离强度和剪切剥离强度的粘合片材，该片材由基材（A）和热粘合层（C）组成，基材（A）包括玻璃化转变温度为 200°C 或以上的全芳香族聚酰亚胺薄膜，热粘合层（C）包括玻璃化转变温度为 200-500°C 的全芳香族聚酰胺，还提供了由该片材组成的层压板及其生产工艺。此外，还提供了一种对由粘合剂片材构成的层压板进行处理后脱模的方法，以获得具有目标待处理层的层压板。
• MULTILAYER BODY
  申请人：TEIJIN LIMITED

  公开号：EP1698460A1

  公开（公告）日：2006-09-06

  A laminate which is advantageously used as an insulating layer for electronic package application and as an adhesive film for fixing a semiconductor wafer for semiconductor device application, laminates comprising the same and a process for manufacturing the above laminate. The laminate (I) comprises a base layer (A) and an adhesive layer (B) formed on one side or both sides of the layer A, the layer A is a film made of (A-1) a specific wholly aromatic polyimide (PIA-1) or (A-2) a specific wholly aromatic polyamide (PAA-2) and the layer B comprises (B-1) a specific wholly aromatic polyimide (PIB-1), (B-2) a specific wholly aromatic polyamide (PAB-2), or (B-3) a specific resin composition (RCB-3) comprising a wholly aromatic polyimide (PIB-3) and a specific wholly aromatic polyamide (PAB-3), laminates comprising the same and a process for manufacturing the above laminate.

  一种可用作电子封装应用中的绝缘层和半导体设备应用中用于固定半导体晶片的粘合膜的层压板、由其组成的层压板以及制造上述层压板的工艺。 层压板(I)包括基底层(A)和在层 A 的一侧或两侧形成的粘合层(B)，层 A 是由(A-1)特定全芳香族聚酰亚胺(PIA-1)或(A-2)特定全芳香族聚酰胺(PAA-2)制成的薄膜，层 B 包括(B-1)特定全芳香族聚酰亚胺(PIB-1)、(B-2) 特定全芳香族聚酰胺 (PAB-2)，或 (B-3) 由全芳香族聚酰亚胺 (PIB-3) 和特定全芳香族聚酰胺 (PAB-3) 组成的特定树脂组合物 (RCB-3)、包括上述组合物的层压板以及制造上述层压板的工艺。
• Adhesive sheet and layered product
  申请人：Yoshitomi Takashi

  公开号：US20060134407A1

  公开（公告）日：2006-06-22

  There are provided an adhesive sheet, exhibiting a specific peel strength and shear peel strength and being composed of a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200° C. or above and a thermal adhesive layer (C) comprising a fully aromatic polyamide having a glass transition temperature of 200-500° C., as well as a laminate composed of the sheet and a process for its production. Also provided is a method of release after treatment of the laminate composed of the adhesive sheet, to obtain a laminate having the target to-be-treated layer.
• Laminate
  申请人：Ishiwata Toyoaki

  公开号：US20070148480A1

  公开（公告）日：2007-06-28

  A laminate which is advantageously used as an insulating layer for electronic package application and as an adhesive film for fixing a semiconductor wafer for semiconductor device application, laminates comprising the same and a process for manufacturing the above laminate. The laminate (I) comprises a base layer (A) and an adhesive layer (B) formed on one side or both sides of the layer A, the layer A is a film made of (A-1) a specific wholly aromatic polyimide (PI A-1 ) or (A-2) a specific wholly aromatic polyamide (PA A-2 ); and the layer B comprises (B-1) a specific wholly aromatic polyimide (PI B-1 ), (B-2) a specific wholly aromatic polyamide (PA B-2 ), or (B-3) a specific resin composition (RC B-3 ) comprising a wholly aromatic polyimide (PI B-3 ) and a specific wholly aromatic polyamide (PA B-3 ), laminates comprising the same and a process for manufacturing the above laminate.