[EN] CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF<br/>[FR] COMPOSITIONS DE POLISSAGE CHIMICO-MÉCANIQUE ET LEURS PROCÉDÉS D'UTILISATION
申请人:[en]FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
公开号:WO2022140075A1
公开(公告)日:2022-06-30
A polishing composition includes at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight below 500 g/mol, at least one azole containing compound, at least one alkylamine compound having a 6-24 carbon alkyl chain, and an aqueous solvent, and optionally, a pH adjuster.