A condensed polycyclic, polynuclear aromatic thermosetting resin with improved moldability which is prevented from forming a cloud on a mold during molding is disclosed. The resin is a prepolymer derived by condensation polymerization of a condensed polycyclic aromatic compound or a mixture thereof with a monocyclic aromatic compounds and an aromatic compound having at least two hydroxymethyl groups as a crosslinking agent in the presence of an acid catalyst. The resin has a flow temperature of not higher than 150°C. The acid catalyst is water-insoluble or when it is water-soluble the resin has an insolubilized acid ratio of at least 50%. The resin is useful in the manufacture of thermoset molded articles having good heat resistance and good mechanical and electrical properties. It can be blended with a filler and/or reinforcing agent to form a molding compound.
本发明公开了一种缩合多环、多核芳香族热固性
树脂,它具有更好的成型性,在成型过程中不会在模具上形成云雾。该
树脂是由缩合多环芳香族化合物或其混合物与单环芳香族化合物和至少有两个羟甲基的芳香族化合物作为
交联剂在酸催化剂存在下缩合聚合而得的预聚物。
树脂的流动温度不高于 150°C。酸催化剂不溶于
水,或当它溶于
水时,
树脂的酸不溶比率至少为 50%。这种
树脂可用于制造具有良好耐热性、机械和电气性能的热固性模塑制品。它可以与填料和/或增强剂混合形成模塑化合物。