申请人:DAI-ICHI KOGYO SEIYAKU CO., LTD.
公开号:EP0735084A1
公开(公告)日:1996-10-02
A thermoplastic styrenic resin is formulated with 2,4,6-tris(2,4,6-tribromophenoxy)-1,3,5-triazine melting at 225-235°C, an alkaline earth metal compound, and an epoxy compound, optionally further with a benzotriazole compound or a hindered amine as light stabilizer and a hindered phenol group-containing phenol compound, a pentaerythritol diphosphite compound, an organotin compound or a hydrotalcite-containing inorganic compound as heat stabilizer.
Provided is a thermoplastic styrenic resin composition with high light resistance, heat resistance, mechanical strength, and flame retardancy, particularly improved in heat resistance.
一种热塑性苯乙烯树脂是用熔点为 225-235°C 的 2,4,6-三(2,4,6-三溴苯氧基)-1,3,5-三嗪、碱土金属化合物和环氧化合物配制而成、可进一步选择使用苯并三唑化合物或受阻胺作为光稳定剂,使用含受阻酚基的苯酚化合物、季戊四醇二亚磷酸酯化合物、有机锡化合物或含氢化talcite的无机化合物作为热稳定剂。
本发明提供了一种热塑性苯乙烯树脂组合物,具有高耐光性、耐热性、机械强度和阻燃性,尤其是耐热性得到改善。