PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER
申请人:TORAY INDUSTRIES, INC.
公开号:EP1909142A1
公开(公告)日:2008-04-09
The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.
Developing solution and method of forming polyimide pattern by using the developing solution
申请人:Yoshiaki Kawamonzen
公开号:US20010006767A1
公开(公告)日:2001-07-05
Disclosed is a developing solution for a photosensitive polyimide, which consists of an aqueous solution of an amine compound having a base dissociation index pKb [=−log (Kb)=−log (Kw/Ka)=14−pKa, where Kb is a base dissociation constant, Ka is acid dissociation constant of a proton complex, pKa is an acid dissociation index of a proton complex=−log (Ka), and Kw is an ion product of water=1×10
−14
] of 5 to 8 within an aqueous solution of 25° C.