Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.
与环氧
树脂和
酚醛
树脂相比,双马来
酰亚胺(BMI)具有优异的耐热性(高 Tg 和高抗热分解性),因此近年来,除了研究双马来
酰亚胺在电子材料应用中的使用外,人们还更加关注双马来
酰亚胺作为以 SiC 功率半导体为代表的下一代设备的
树脂材料。因此,传统的双马来
酰亚胺是众所周知的高耐热性
树脂;然而,在先进材料应用等方面,需要一种具有更高耐热性的
树脂。因此,本发明的目的是提供一种具有优异耐热性的新型马来
酰亚胺化合物。本发明公开了一种含取代或未取代烯丙基的马来
酰亚胺化合物,其结构具有三个或三个以上苯环,具有一个或多个基团,每个基团具有一个取代或未取代烯丙基,并具有一个或多个马来
酰亚胺基团。