A method for etching silicon-containing films is disclosed. The method includes the steps of introducing a vapor of a nitrogen containing etching compound into a reaction chamber containing a silicon-containing film on a substrate, wherein the nitrogen containing etching compound is an organofluorine compound containing at least one C≡N or C═N functional group; introducing an inert gas into the reaction chamber; and activating a plasma to produce an activated nitrogen containing etching compound capable of etching the silicon-containing film from the substrate.
本发明公开了一种蚀刻含
硅薄膜的方法。该方法包括以下步骤:将含氮蚀刻化合物的蒸汽引入含有基底上含
硅薄膜的反应室,其中含氮蚀刻化合物是一种
有机氟化合物,含有至少一个C≡N或C═N官能团;将惰性气体引入反应室;以及激活等离子体,以产生能够从基底蚀刻含
硅薄膜的活化含氮蚀刻化合物。