5-methyl-naphthalene-1,6-diol | 856197-39-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 5-methyl-naphthalene-1,6-diol
• 英文别名: 5-Methyl-naphthalin-1,6-diol；5-Methylnaphthalene-1,6-diol
• CAS: 856197-39-2
• 化学式: C₁₁H₁₀O₂
• 分子量: 174.199
• InChiKey: BGELYRIKKWBDFK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  13
• 可旋转键数：
  0
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.09
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  5-methyl-naphthalene-1,6-diol 、 硫酸二甲酯 生成 2,5-二甲氧基-1-甲基萘
  参考文献：
  名称：

  Cornforth et al., Journal of the Chemical Society, 1955, p. 3348,3360

  摘要：

  DOI：
• 作为产物：
  描述：

  5-Amino-1-methyl-[2]naphthol 在 sodium hydrogensulfite 作用下， 生成 5-methyl-naphthalene-1,6-diol
  参考文献：
  名称：

  Cornforth et al., Journal of the Chemical Society, 1955, p. 3348,3360

  摘要：

  DOI：

文献信息

• Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica
  申请人：Sugioka Takuo

  公开号：US20060167164A1

  公开（公告）日：2006-07-27

  The present invention has for its object to provide a fire retardant resin composition which is not only halogen-free and, hence, eliminating the adverse effect to the environment and human physiology but also reflecting an excellent fire retardancy imparted to a polyphenol having inherently favorable physical properties and heat resistance. The present invention is a fire retardant resin composition comprising a polyphenol compound and an inorganic microfine particle, wherein said polyphenol compound has such a structure that aromatic units each having at least one phenolic hydroxyl group are connected to one another through an organic unit containing two or more carbon atoms, and said inorganic microfine particle is a product of hydrolysis and condensation of an alkoxide compound and/or a carboxylic acid salt compound.

  本发明的目的是提供一种阻燃树脂组合物，该组合物不仅不含卤素，因而消除了对环境和人体生理的不利影响，而且反映了具有固有良好物理性能和耐热性能的多酚所赋予的优异阻燃性。本发明是一种阻燃树脂组合物，包括一种多酚化合物和一种无机微细颗粒，其中所述多酚化合物具有这样一种结构，即每个具有至少一个酚羟基的芳香单元通过含有两个或两个以上碳原子的有机单元相互连接，而所述无机微细颗粒是烷氧基化合物和/或羧酸盐化合物水解和缩合的产物。
• [EN] FIRE RETARDANT RESIN COMPOSITION, METHOD OF ITS PRODUCTION, SHAPED ARTICLES COMPRISING THE SAME, AND SILICA<br/>[FR] COMPOSITION DE RESINE IGNIFUGE, SON PROCEDE DE FABRICATION, ARTICLES FORMES LA COMPRENANT ET SILICE
  申请人：NIPPON CATALYTIC CHEM IND

  公开号：WO2003099934A1

  公开（公告）日：2003-12-04

  The present invention has for its object to provide a fire retardant resin composition which is not only halogen-free and, hence, eliminating the adverse effect to the environment and human physiology but also reflecting an excellent fire retardancy imparted to a polyphenol having inherently favorable physical properties and heat resistance. The present invention is a fire retardant resin composition comprising a polyphenol compound and an inorganic microfine particle, wherein said polyphenol compound has such a structure that aromatic units each having at least one phenolic hydroxyl group are connected to one another through an organic unit containing two or more carbon atoms, and said inorganic microfine particle is a product of hydrolysis and condensation of an alkoxide compound and/or a carboxylic acid salt compound.

  本发明的目的是提供一种阻燃树脂组合物，该组合物不仅不含卤素，从而消除了对环境和人体生理的不良影响，而且还通过一种具有内在良好物理特性和耐热性的聚苯酚表现出优异的阻燃性。本发明是一种阻燃树脂组合物，包含聚苯酚化合物和无机超微细颗粒，其中所述聚苯酚化合物具有这样的结构，即每个具有至少一个苯酚羟基的芳香单元通过包含两个或更多碳原子的有机单元相互连接，所述无机超微细颗粒是由烷氧基化合物和/或羧酸盐化合物水解和缩聚得到的产品。
• FIRE RETARDANT RESIN COMPOSITION, METHOD OF ITS PRODUCTION, SHAPED ARTICLES COMPRISING THE SAME, AND SILICA
  申请人：Nippon Shokubai Co., Ltd.

  公开号：EP1507829A1

  公开（公告）日：2005-02-23
• EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN
  申请人：Ogura Ichiro

  公开号：US20110275739A1

  公开（公告）日：2011-11-10

  An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
• COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
  申请人：DIC CORPORATION

  公开号：US20160122269A1

  公开（公告）日：2016-05-05

  There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.