The present invention addressed the problem of providing a highly reliable thermosetting resin composition which is suitable for use in a sealing material for a semiconductor device and in which warpings and cracks do not occur even when used in a power device, in particular.
The problem is solved by a thermosetting resin composition that includes a thermosetting resin and a curing catalyst, wherein the cured product of the thermosetting resin composition has a storage modulus at 25°C of 1.0 × 106 Pa to 1.0 × 1010 Pa and an average linear expansion coefficient at 70 to 210°C of 100 ppm/K or less.
本发明要解决的问题是提供一种高可靠性的热固性
树脂组合物,该组合物适合用于半导体器件的密封材料,即使用于功率器件,也不会出现翘曲和裂纹。
该问题是通过一种热固性
树脂组合物解决的,该组合物包括一种热固性
树脂和一种固化催化剂,其中该热固性
树脂组合物的固化产物在 25°C 时的储存模量为 1.0 × 106 Pa 至 1.0 × 1010 Pa,在 70 至 210°C 时的平均线膨胀系数为 100 ppm/K 或更小。