申请人:——
公开号:US20030219680A1
公开(公告)日:2003-11-27
A radiation-sensitive resin composition suitable as a chemically-amplified resist is provided. The composition comprised (A) a resin insoluble or scarcely soluble in alkali, but becoming alkali soluble by the action of an acid, and (B) a photoacid generator. The resin comprises a recurring unit of the following formula (I),
1
wherein R
1
is typically a hydrogen atom and the —C (R
5
)
3
structure is a 2-methyl-2-tricyclodecanyl group, 2-ethyl-2-tricyclodecanyl group, 2-methyl-2-adamantyl group, 2-ethyl-2-adamantyl group, 1-methylcyclopentyl group, 1-ethylcyclopentyl group, 1-methylcyclohexyl group, or 1-ethylcyclohexyl group.
提供一种适用于化学放大光刻胶的辐射敏感树脂组合物。该组合物包含(A)一种碱不溶或难溶的树脂,但在酸的作用下变得碱溶,以及(B)一种光酸发生剂。该树脂包含以下式(I)的重复单元,其中R1通常是氢原子,而—C(R5)3结构是2-甲基-2-三环己基基团、2-乙基-2-三环己基基团、2-甲基-2-金刚烷基团、2-乙基-2-金刚烷基团、1-甲基环戊基团、1-乙基环戊基团、1-甲基环己基团或1-乙基环己基团。