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Hexamethylen-dicyanamid | 2187-94-2

中文名称
——
中文别名
——
英文名称
Hexamethylen-dicyanamid
英文别名
6-(Cyanoamino)hexylcyanamide
Hexamethylen-dicyanamid化学式
CAS
2187-94-2
化学式
C8H14N4
mdl
——
分子量
166.226
InChiKey
PLHYQJABEPDNHQ-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2
  • 重原子数:
    12
  • 可旋转键数:
    7
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.75
  • 拓扑面积:
    71.6
  • 氢给体数:
    2
  • 氢受体数:
    4

反应信息

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文献信息

  • A process for preparing peroxide-based bleach media and concentrated bleach compositions for use in carrying out that process
    申请人:SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.
    公开号:EP0008475A1
    公开(公告)日:1980-03-05
    A process for preparing peroxide-based bleach media and concentrated bleach compositions for use in carrying out that process, the process comprising incorporating in an aqueous medium a peroxide-based bleach and an activator therefor. In order to provide a bleach medium which is effective at temperatures at which home laundering is conventionally carried out the activator so incorporated is a cyanoamine and the medium is maintained alkaline, if necessary by the incorporation of a buffering agent. The cyanomaines are those of equivalent weight 44 to 600 which have the molecular formula: , in which R, and Rz represent hydrogen or Group IA metal atoms (with certain provisos) or certain hydrocarbyl, alkanoyl, ethoxylate, or propoxylate, cyanoamino or polyalkenylamino groups or in which R, and R2 taken together with the amino nitrogen atom to which they are attached form either (a) a 4 to 6 carbon atom-containing ring in which defined substituents may optionally be present on one or more of said carbon atoms or (b) a heterocyclic ring of 5 to 7 atoms which contains hetero atoms selected from 0, S and N-R3, in which R3 can be a hydrogen atom or certain hydrocarbyl, alkanoyl or cyano groups or another heterocyclic ring of 5 to 7 atoms, and in which defined substituents may optionally be present on one or more of the heterocyclic ring carbon atoms. The bleach and the activator can be incorporated in the aqueous medium separately or in the form of a liquid or solid concentrated bleach composition.
    一种制备过氧化物漂白剂介质和用于该工艺的浓缩漂白剂组合物的工艺,该工艺包括在水介质中加入过氧化物漂白剂及其活化剂。 为了使漂白介质在通常进行家庭洗涤的温度下有效,所加入的活化剂为氰胺,介质保持碱性,必要时加入缓冲剂。氰胺的等效重量为 44 至 600,分子式为 其中 R 和 Rz 代表氢或第 IA 组金属原子(带某些但书)或某些烃基、烷酰基、乙氧基或 丙氧基、氰基氨基或聚烯基氨基,或其中 R 和 R2 与它们所连接的氨基氮原子一起形成 (a) 一个含 4 至 6 个碳原子的环,其中定义的取代基可任选存在于一个或多个所述碳原子上;或 (b) 一个含 5 至 7 个原子的杂环,其中含有选自 0、S 和 N-R3 的杂原子,其中定义的取代基可任选存在于一个或多个所述碳原子上、S 和 N-R3,其中 R3 可以是氢原子或某些烃基、烷酰基或氰基,或另一个 5 至 7 个原子的杂环,其中定义的取代基可以选择性地存在于一个或多个杂环碳原子上。 漂白剂和活化剂可以分别或以液体或固体浓缩漂白剂组合物的形式加入水介质中。
  • Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof
    申请人:HITACHI, LTD.
    公开号:EP0102052A2
    公开(公告)日:1984-03-07
    A polymer having excellent heat resistance and mechanical properties and comprising chemical structural units of the following formulae [I] and [II]: (polymer unit having an isomelamine ring) (polymer unit having a normal melamine ring) wherein A and B each represents an at least divalent organic group having at least one aromatic ring and m and n each represents a number of at least 1.
    一种具有优异耐热性和机械性能的聚合物,由下式[I]和[II]的化学结构单元组成: (具有异戊胺环的聚合物单元) (具有一个普通三聚氰胺环的聚合物单元) 其中 A 和 B 分别代表至少具有一个芳香环的二价有机基团,m 和 n 分别代表至少为 1 的数字。
  • Resin encapsulated semiconductor device and process for producing the same
    申请人:HITACHI, LTD.
    公开号:EP0123262A2
    公开(公告)日:1984-10-31
    The resin encapsulated semiconductor device having improved moisture resistance and thermal stability is provided with a resin encapsulation and/or resin coating of a resin material containing isomelamine rings and melamine rings.
    树脂封装半导体器件具有更好的防潮性和热稳定性,其树脂封装和/或树脂涂层是由含有异戊胺环和三聚氰胺环的树脂材料构成的。
  • Polyolefin resinsompositions and process for producing same
    申请人:SUMITOMO CHEMICAL COMPANY, LIMITED
    公开号:EP0440923A1
    公开(公告)日:1991-08-14
    A resin composition prepared by melting and kneading (A) a thermoplastic resin comprising a polyolefin resin together with (B) a functional compound having one or more bond(s) or one or more functional group(s) selected from non-aromatic carbon-carbon multiple bonds, oxirane groups and substituted carboxyl groups, and subsequently mixing thereinto (C) a polar compound having in one molecule one or more polar group(s) selected from substituted carboxyl groups, substituted hydroxyl groups, substituted amino groups, substituted mercapto groups, substituted sulfonic acid groups, oxazoline groups, isocyanato groups and oxirane groups, provided that at least one of the polar groups of (C) is different from at least one of the functional groups of the functional compound (B), as well as a process for producing said resin composition.
    一种树脂组合物,通过熔化和捏合(A)由聚烯烃树脂组成的热塑性树脂和(B)具有一个或多个键或一个或多个选自非芳香族碳-碳多键、环氧乙烷基团和取代羧基的官能团的功能化合物,并随后混合(C)在一个分子中具有一个或多个选自取代羧基的极性基团的极性化合物而制备、取代的羟基、取代的氨基、取代的巯基、取代的磺酸基、噁唑啉基、异氰酸基和环氧乙烷基,条件是 (C) 的至少一个极性基团与官能团化合物 (B) 的至少一个官能团不同,以及生产所述树脂组合物的工艺。
  • Multi-layer wiring substrate and production thereof
    申请人:HITACHI, LTD.
    公开号:EP0476589A2
    公开(公告)日:1992-03-25
    A multi-layer wiring substrate for directly mounting chips or chip carriers obtained by using as adhesive layers and/or insulating layers a cured product of a special ether imide compound alone or together with at least one of aromatic cyanamide compounds, cyanurate compounds and cyanate compounds, is excellent in flexibility, solder heat resistance, high temperature fluidity and adhesiveness to copper conductors.
    一种用于直接安装芯片或芯片载体的多层布线基板,是将一种特殊的醚酰亚胺化合物单独或与芳香族氰酰胺化合物、氰尿酸酯化合物和氰酸酯化合物中的至少一种化合物一起作为粘合层和/或绝缘层固化而成的,具有优异的柔韧性、耐焊热性、高温流动性和与铜导体的粘合性。
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