4,4'-(9H-Fluorene-9,9-diyl)bis(2-bromophenol) | 169169-49-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 4,4'-(9H-Fluorene-9,9-diyl)bis(2-bromophenol)
• 英文别名: 2-bromo-4-[9-(3-bromo-4-hydroxyphenyl)fluoren-9-yl]phenol
• CAS: 169169-49-7
• 化学式: C₂₅H₁₆Br₂O₂
• 分子量: 508.2
• InChiKey: ZKTNABJAOZQJCM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.3
• 重原子数：
  29
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• PHOTOSENSITIVE RESIN COMPOSITION AND CURING PRODUCT THEREOF
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1600812A1

  公开（公告）日：2005-11-30

  A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin (A) soluble in aqueous alkali solutions, the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).

  一种光敏树脂组合物，该组合物对放电能量射线（光敏性）的敏感性优异，可在短时间内硬化，通过稀释的碱水溶液显影可形成图案，通过后固化步骤的热固化可得到固化膜，固化膜具有令人满意的柔韧性，适用于高绝缘性的阻焊油墨，该阻焊油墨的附着力和抗镀金、无电解镀金和镀锡的能力优异；及其固化产品。特别是一种光敏树脂组合物，其特征在于包括 (1) 可溶于碱水溶液的聚氨酯树脂 (A)，该聚氨酯树脂是通过在无催化剂的情况下对二异氰酸酯化合物 (a) 进行氨基甲酸乙酯化而得到的、分子中含有乙烯不饱和基团的二元醇化合物 (b) 和分子中含有羧基的二元醇化合物 (c)，可选择与分子中不含有任何乙烯不饱和基团或羧基的二元醇化合物 (d) 一起反应，并使反应产物与环酸酐 (e) 反应而得到的聚氨酯树脂；(2) 光聚合引发剂 (B)；以及 (3) 反应性交联剂 (C)。
• Alkali-soluble resin, photosensitive resin composition for color filter containing the same and uses thereof
  申请人：CHI MEI CORPORATION

  公开号：US10088612B2

  公开（公告）日：2018-10-02

  The present invention relates to an alkali-soluble resin (A) and a photosensitive resin composition for a color filter and uses thereof. The photosensitive resin composition includes the alkali-soluble resin (A), a compound (B) containing an ethylenically unsaturated group, a photoinitiator (C) and an organic solvent (D). The photosensitive resin composition according to the present invention can improve the change rate of film thickness in thermal solvent and linearity of pattern with high finesse of the color filter.

  本发明涉及一种碱溶性树脂（A）和一种用于彩色滤光片的感光树脂组合物及其用途。光敏树脂组合物包括碱溶性树脂（A）、含有乙烯不饱和基团的化合物（B）、光引发剂（C）和有机溶剂（D）。根据本发明的感光树脂组合物可以提高热溶剂中膜厚的变化率和图案的线性度，滤色片的精细度也很高。
• Wavelength conversion member, backlight unit, image display device, and method of manufacturing wavelength conversion member
  申请人：FUJIFILM Corporation

  公开号：US10605433B2

  公开（公告）日：2020-03-31

  A wavelength conversion member, is provided with a wavelength conversion layer that includes quantum dots and is interposed between two barrier layers. The wavelength conversion member includes a light scattering layer that is provided between the barrier layers and the wavelength conversion layer, in which one of the barrier layers closest to the light scattering layer is formed of an inorganic component, the light scattering layer includes a binder, which is formed of either a compound having a hydrogen bonding functional group and a polymerizable group in a molecule or an organic metal coupling agent, and scattering particles having a diameter R of 0.2 to 5 μm, a thickness d of the light scattering layer is 0.2 to 4 μm, a thickness D of the wavelength conversion layer is 10 to 100 μm, and a ratio of d to D is 0.2% to 10%.

  一种波长转换部件具有一个波长转换层，该转换层包括量子点，并置于两个阻挡层之间。波长转换部件包括一个光散射层，设置在阻挡层和波长转换层之间，其中最靠近光散射层的阻挡层之一由无机成分形成，光散射层包括粘合剂，由分子中具有氢键官能团和可聚合基团的化合物或有机金属偶联剂形成，散射粒子的直径 R 为 0.2至5微米，光散射层的厚度d为0.2至4微米，波长转换层的厚度D为10至100微米，d与D的比率为0.2%至10%。
• Photo-or heat-curable resin composition and multilayer printed wiring board
  申请人：——

  公开号：US20020051942A1

  公开（公告）日：2002-05-02

  This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of the resin-forming component containing a photo- or heat-polymerizable unsaturated compound and 0.01-5 parts by weight of an inorganic filler such as silica sol with its average particle diameter controlled in the range 5 nm-0.5 &mgr;m. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.

  本发明涉及一种光固化或热固化树脂组合物，其固化产品开裂少，可靠性高。本发明的树脂组合物包括 100 重量份的树脂形成组分，其中含有可光化或热聚合的不饱和化合物，以及 0.01-5 重量份的无机填料，如硅溶胶，其平均粒径控制在 5 nm-0.5 &mgr;m。该组合物具有高耐热性和良好的微细加工质量，可通过堆积工艺用作半导体器件等电子零件的外围材料，例如用作多层印刷线路板中形成绝缘层的材料。
• Photo- or heat-curable resin composition and multilayer printed wiring board
  申请人：——

  公开号：US20020103270A1

  公开（公告）日：2002-08-01

  This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate , 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.

  本发明涉及一种光固化或热固化树脂组合物，其固化产品裂纹极少，可靠性高。本发明的树脂组合物包括 100 重量份的(A)由双酚-环氧（甲基）丙烯酸酯的聚羧酸加合物组成的可光聚合或热聚合的不饱和化合物、10-100 重量份的(B)（甲基）丙烯酸酯的环氧烷改性产物或其低聚物、0-50 重量份的(C)含环氧基的化合物和 0-50 重量份的(D)光聚合引发剂或敏化剂。该组合物具有高耐热性和良好的微细加工质量，可通过堆积工艺用作半导体器件等电子零件的外围材料，例如用作多层印刷线路板中形成绝缘层的材料。