This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one compound comprising at least three hydroxyl groups; 4) at least one carboxylic acid; 5) at least one Group II metal cation; 6) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 7) water. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.
本公开涉及含有以下成分的组合物:1)至少一种
水溶性极性烷基有机溶剂;2)至少一种氢氧化季
铵;3)至少一种包含至少三个羟基的化合物;4)至少一种
羧酸;5)至少一种第二类
金属阳离子;6)至少一种
铜腐蚀
抑制剂,该
抑制剂选自 6-取代-
2,4-二氨基-1,3,5-三嗪组成的组;以及 7)
水。这些组合物可以有效地剥离正或负色调抗蚀剂或抗蚀剂残留物,并且对半导体衬底上的凸点和底层
金属化材料(如 SnAg、CuNiSn、CuCoCu、CoSn、Ni、Cu、Al、W、Sn、Co 等)无腐蚀性。