[EN] ACIDIC BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT CONTAINING HALOGENATED OR PSEUDOHALOGENATED MONOMERIC PHENAZINIUM COMPOUNDS [FR] BAIN ACIDE DE DEPOT ELECTROLYTIQUE D'UNE COUCHE DE CUIVRE CONTENANT DES COMPOSES DE PHENAZINIUM HALOGENES OU PSEUDOHALOGENES MONOMERIQUES
Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
申请人:Brunner Heiko
公开号:US20060226021A1
公开(公告)日:2006-10-12
For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phenazinium compounds. The mixture contains at least one phenazinium compound selected from the group comprising compounds containing two monomeric units and compounds containing three monomeric units having the general chemical formulae and set forth in the patent claims and in the specification as well as further oligomeric phenazinium compounds.