RESIN COMPOSITION, LAMINATE, RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR WAFER, SUBSTRATE FOR MOUNTING RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
申请人:MITSUBISHI GAS CHEMICAL COMPANY, INC.
公开号:EP3786200A1
公开(公告)日:2021-03-03
A resin composition that has excellent flux activity, flexibility and storage stability and that is suitable for a pre-applied underfill material is provided. The resin composition of the present invention contains a compound (A) having a phenolic hydroxy group, a metal ion trapping agent (B) and a radical polymerizable compound (C).
本发明提供了一种树脂组合物,该树脂组合物具有优异的通量活性、柔韧性和贮存稳定性,适用于预涂敷的底部填充材料。本发明的树脂组合物含有一种具有酚羟基的化合物(A)、一种金属离子捕获剂(B)和一种可自由基聚合的化合物(C)。