2-(3-乙基苯胺基)-3,7-二氢嘌呤-6-酮 | 123994-69-4

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 咪唑并嘧啶类
• 中文名称: 2-(3-乙基苯胺基)-3,7-二氢嘌呤-6-酮
• 英文名称: 6H-Purin-6-one, 2-((3-ethylphenyl)amino)-1,9-dihydro-
• 英文别名: 2-(3-ethylanilino)-1,7-dihydropurin-6-one
• CAS: 123994-69-4
• 化学式: C₁₃H₁₃N₅O
• 分子量: 255.279
• InChiKey: RPKIAWXFDCYUPC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  19
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.15
• 拓扑面积：
  82.2
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  2-溴次黄嘌呤 、 3-乙基苯胺 以 乙二醇甲醚 为溶剂， 以59%的产率得到2-(3-乙基苯胺基)-3,7-二氢嘌呤-6-酮
  参考文献：
  名称：

  N2-Phenyldeoxyguanosine: a novel selective inhibitor of herpes simplex thymiding kinase

  摘要：

  A series of N2-substituted guanine derivatives was screened against mammalian thymidine kinase and the thymidine kinase encoded by type I herpes simplex virus to examine their capacity to selectivity inhibit the viral enzyme. Several bases, nucleosides, and nucleotides displayed selective activity. The mechanism of action of the most potent derivative, N2-phenyl-2'-deoxyguanosine (PhdG) was studied in detail. PhdG (a) inhibited the viral enzyme competitively with respect to the substrates thymidine and deoxycytidine, (b) was completely resistant to phosphorylation, (c) displayed limited toxicity for the HeLa cell lines employed as hosts for viral infection, and (d) selectively inhibited viral thymidine kinase function in intact cultured cells. The results indicate that the PhdG drug prototype has potential as a selective anti-herpes agent and as a novel molecular probe of the structure and function of herpes simplex thymidine kinase.

  DOI：

  10.1021/jm00403a004

文献信息

• NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
  申请人：Asahi Kasei Kabushiki Kaisha

  公开号：EP4006073A1

  公开（公告）日：2022-06-01

  To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.

  提供一种负感光树脂组合物，该组合物即使在聚焦深度发生偏移时也能表现出令人满意的分辨率，并且与模具树脂具有令人满意的粘附性，并表现出较低的介电常数；提供一种使用该感光树脂组合物生产聚酰亚胺的方法；提供一种生产固化浮雕图案的方法；以及提供一种包括固化浮雕图案的半导体器件。 本发明公开了一种阴性光敏树脂组合物，该组合物包括具有通式(A1)表示的结构的聚酰亚胺前体、(B)光聚合引发剂和(C)溶剂。
• Photosensitive resin composition, polyimide production method, and semiconductor device
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US10719016B2

  公开（公告）日：2020-07-21

  A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of R1 to R4 independently represents a hydrogen atom or a monovalent organic group).

  可以提供一种光敏树脂组合物，确保在高温储存测试后，与聚酰亚胺层接触的铜层界面不易产生空洞，并获得高粘合性聚酰亚胺层，以及使用该光敏树脂组合物的聚酰亚胺。此外，还可以提供一种半导体器件，该器件在经过高温存储测试后，与聚酰亚胺层接触的铜层界面上不易产生空洞，并且在经过高温存储测试后也不易发生短路或断路。 光敏树脂组合物的特点是包括作为光敏聚酰亚胺前体的组分（A）和含有式（B1）所代表结构的组分（B）。 (在式 (B1) 中，Z 是硫原子或氧原子，R1 至 R4 各自独立地代表氢原子或一价有机基团）。
• Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US10831101B2

  公开（公告）日：2020-11-10

  A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

  一种光敏树脂组合物含有一种树脂和一种化合物，每种树脂和化合物都具有本说明书规定的结构，这种组合物提供的固化薄膜对铜线具有极佳的粘合性。
• Photosensitive resin composition and method for producing cured relief pattern
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US11163234B2

  公开（公告）日：2021-11-02

  A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

  一种负型感光树脂组合物，该组合物具有令人满意的亚胺化率，即使在 200°C 或以下的低温固化条件下也能生成具有高耐化学腐蚀性的树脂层，该负型感光树脂组合物含有光聚合引发剂 (B)，其与聚酰亚胺前体 (A) 的质量比为 0.相对于 100 份聚酰亚胺前体（A）而言，聚酰亚胺前体（A）的质量为 1 份至 20 份，聚酰亚胺前体（A）为具有特定结构的聚酰胺酸酯或聚酰胺酸盐，根据凝胶渗透色谱法（GPC），聚酰亚胺前体（A）的重量平均分子量（Mw）为 3,000 或更大且小于 16,000 （以聚苯乙烯计）。
• PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US20180373147A1

  公开（公告）日：2018-12-27

  A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).