REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME
申请人:Watanabe Hisashi
公开号:US20100059261A1
公开(公告)日:2010-03-11
A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I):
wherein one of X and Y represents O and the other represents NAr
2
R
2
, and R
1
, R
2
, Ar
1
, and Ar
2
are as defined in the specification, and a resin composition comprising the compound as a reactive monomer.